Memory IC GD25LQ255EFJRR product image

GD25LQ255EFJRR

$2.24
  • Description:IC FLASH 256MBIT SPI/QUAD 16SOP
  • Series:GD25LQ
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:5fb44d77aa8b Category: Brand:

  
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GD25LQ255EFJRR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 256MBIT SPI/QUAD 16SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LQ255EFJRR

  • Description:IC FLASH 256MBIT SPI/QUAD 16SOP
  • Series:GD25LQ
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:256Mbit
  • Memory Organization:32M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:16-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package:16-SOP
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LQ255EFJRR

GD25LQ255EFJRR

Memory IC Overview

The GD25LQ255EFJRR is a 256M-bit (32M-byte) SPI NOR flash memory manufactured by GigaDevice. It supports standard, dual, and quad SPI interfaces with QPI mode capability. The device operates on a single power supply voltage ranging from 1.65V to 2.0V. It features a uniform sector architecture with 4K-byte sectors and 32/64K-byte blocks. Maximum clock frequency reaches 133MHz for fast read operations under a 30pF load. Page program time is typically 0.25ms, while sector erase takes approximately 30ms. The component ensures high endurance with a minimum of 100,000 program/erase cycles and typical data retention of 20 years.

Memory IC Feature Summary

  • Supports Dual and Quad Serial Flash operations including QPI mode for high-speed data transfer up to 532Mbits/s.
  • Provides advanced security features such as 128-bit Unique ID, SFDP registers, and software/hardware write protection via WP# pin.
  • Features flexible architecture allowing 3 or 4-byte address modes and uniform block/sector organization.
  • Designed for low power consumption with typical standby current of 11μA and deep power-down current of 1μA.

Memory IC Applications

  • Execute In Place (XiP) operation for code storage in embedded systems.
  • Storage for firmware and boot code in consumer electronics and IoT devices.
  • Data logging and configuration storage in industrial control applications.
  • Cache memory expansion for system-on-chip (SoC) architectures.

Memory IC Procurement Notes

Verify the specific suffix 'EFJRR' against the manufacturer's official ordering information table to confirm package type and tape/reel specifications. Ensure compatibility with the required voltage range of 1.65V to 2.0V for your target application design. Confirm that the selected package variant matches your PCB layout constraints and assembly capabilities.

Memory IC Selection Notes

Select this component when a 256M-bit density with low-voltage operation (1.65V-2.0V) is required. It is suitable for designs needing high-speed read performance via Quad I/O or QPI modes. Consider the available package options such as SOP16 or WSON8 based on space limitations. Ensure the system supports the necessary SPI command set for dual and quad operations if high throughput is needed.

Memory IC Part Context

The GD25LQ255E series belongs to GigaDevice's family of uniform sector serial flash memories. These devices are designed to offer high reliability and flexibility for various storage needs. The series supports multiple interface modes and includes robust security features. They are commonly used in applications requiring non-volatile code storage with fast access times and low power consumption profiles.

Memory IC Replacement Considerations

Check for other GD25LQ255E variants with different suffixes that may offer alternative packages like WSON8 or TFBGA. Verify if lower density parts like GD25LQ128 or higher density parts like GD25LQ512 meet capacity requirements. Ensure any substitute maintains the same 1.65V-2.0V voltage range and SPI/QPI compatibility.

GD25LQ255EFJRRGD25LQ255EFJRR
$2.24
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