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GD25LQ255ESIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 256MBIT SPI/QUAD. Review the specifications below when checking this part for your BOM.
The GD25LQ255ESIGR is a 256Mbit SPI NOR Flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 1.65V to 2V and supports an interface clock frequency of up to 133 MHz. The component utilizes an 8-SOP (SOIC) surface-mount package with a width of 5.30mm. It features a memory organization of 32M x 8 bits and supports Single, Dual, Quad I/O, and QPI modes. The device is rated for industrial operating temperatures ranging from -40°C to +85°C.
Verify the specific suffix 'E' against the manufacturer's current datasheet to confirm package dimensions and pinout compatibility. Ensure the design accommodates the 1.65V to 2V voltage range. Check for any moisture sensitivity level requirements during assembly. Confirm that the 8-SOP package fits the target PCB footprint. Validate that the 133 MHz maximum clock speed meets system timing constraints.
Select this component when a 256Mbit density is required in an 8-pin SOIC package. It is suitable for designs needing industrial temperature stability. Consider alternatives if a wider voltage range or different package style like WSON is preferred. Verify that the 133 MHz speed is sufficient for the application's read performance needs.
This part belongs to the GD25LQ series of SPI NOR Flash memories from GigaDevice. The series targets applications requiring reliable code execution and data storage. The GD25LQ255ESIGR specifically offers a balance of capacity and interface speed in a compact surface-mount form factor.
GD25LQ255EWIGR is listed as a parameter-equivalent alternative. Verify package compatibility between SOP and WSON variants before substitution.
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