Memory IC GD25LQ256DWIGR product image

GD25LQ256DWIGR

$2.92
  • Description:IC FLASH 256MBIT SPI/QUAD 8WSON
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:dd001baad550 Category: Brand:

  
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GD25LQ256DWIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 256MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LQ256DWIGR

  • Description:IC FLASH 256MBIT SPI/QUAD 8WSON
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:256Mbit
  • Memory Organization:32M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:120 MHz
  • Write Cycle Time - Word, Page:2.4ms
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-WDFN Exposed Pad
  • Supplier Device Package:8-WSON (5x6)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LQ256DWIGR

GD25LQ256DWIGR

Memory IC Overview

The GD25LQ256DWIGR is a non-volatile NOR flash memory integrated circuit manufactured by GigaDevice. It provides a storage capacity of 256 Mbit, organized as 32M x 8 bits. The device utilizes an SPI interface with Quad I/O support and operates at a maximum clock frequency of 120 MHz. It functions within a supply voltage range of 1.65V to 2V and supports an industrial operating temperature range from -40°C to +85°C. The component is housed in an 8-WSON package measuring 5x6 mm.

Memory IC Feature Summary

  • Supports high-speed SPI communication with Quad I/O capabilities for efficient data transfer.
  • Features low-voltage operation suitable for power-constrained embedded systems.
  • Includes hardware reset functionality and security registers with OTP locks.

Memory IC Applications

  • Industrial control systems requiring reliable code storage
  • Consumer electronics utilizing low-power microcontrollers
  • Embedded applications needing compact surface-mount memory solutions

Memory IC Procurement Notes

Verify the current part status before integration, as this component is marked Not For New Designs (NRND). Confirm that the 8-WSON package dimensions align with your PCB footprint requirements. Ensure your design accommodates the specified 1.65V to 2V supply voltage range and industrial temperature limits. Check for moisture sensitivity level constraints during assembly processing.

Memory IC Selection Notes

Select this component when a 256 Mbit density is required in a small 8-WSON form factor. It is appropriate for designs prioritizing low voltage operation over higher speed interfaces found in 3V variants. Consider the NRND status if long-term production stability is critical for the product lifecycle. Compare against other GD25LQ series parts for package or speed differences.

Memory IC Part Context

This part belongs to the GD25LQ256D series of SPI NOR flash memories. It shares the base product number GD25LQ256 but differs in packaging and suffix specifications. It is distinct from the GD25Q256DBIGY, which uses a TFBGA package and operates at a different voltage range. The series targets applications requiring robust performance in industrial environments.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with alternative components from the same manufacturer family based on pinout and electrical specifications.

GD25LQ256DWIGRGD25LQ256DWIGR
$2.92
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