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GD25LQ32DSIG is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 32MBIT SPI/QUAD 8SOP. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25LQ32DSIG
- Description：IC FLASH 32MBIT SPI/QUAD 8SOP
- Series：-
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tube
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR
- Memory Size：32Mbit
- Memory Organization：4M x 8
- Memory Interface：SPI - Quad I/O
- Clock Frequency：120 MHz
- Write Cycle Time - Word, Page：2.4ms
- Voltage - Supply：1.65V ~ 2V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-SOIC (0.209", 5.30mm Width)
- Supplier Device Package：8-SOP
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25LQ32DSIG
Memory IC Overview
The GD25LQ32DSIG is a 32M-bit (4M x 8) SPI NOR flash memory manufactured by GigaDevice. It operates on a single 1.65V to 2.0V power supply and supports standard, dual, quad SPI, and QPI interfaces with a maximum clock frequency of 120MHz. The device features uniform 4K-byte sectors and 32/64K-byte blocks within an 8-lead SOP package. It includes hardware write protection, security registers, and a unique ID.
Memory IC Feature Summary
- Supports Dual and Quad I/O data transfer modes for high-speed read operations
- Provides flexible software and hardware-based write protection mechanisms
- Integrates 128-bit unique identification for device tracking
- Enables Execute In Place (XIP) operation for direct code execution
Memory IC Applications
- Consumer electronics firmware storage
- Industrial control system code storage
- IoT device configuration and data logging
- Network communication equipment boot code
Memory IC Procurement Notes
Verify the specific suffix 'SIG' corresponds to the SOP-8 tube packaging and industrial temperature range (-40°C to +85°C). Confirm RoHS compliance status through official documentation. Ensure ESD handling procedures are followed during assembly due to moisture sensitivity classification.
Memory IC Selection Notes
Select this component when a 32M-bit capacity is required with a strict 1.8V voltage constraint. The SOP-8 package is suitable for applications prioritizing cost-effective surface-mount assembly over miniaturization. Verify interface compatibility with host controllers supporting Quad SPI or QPI modes for optimal performance.
Memory IC Part Context
This part belongs to the GD25LQ32D series, which offers uniform sector architecture. It is designed for applications requiring reliable non-volatile storage with low power consumption. The series supports various package options including WSON and USON, but the SIG suffix specifically denotes the SOP-8 variant.
Memory IC Replacement Considerations
GD25LQ32DWIGR: Same electrical specifications but in WSON-8 tape and reel packaging.
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