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GD25LQ32DSIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 32MBIT SPI/QUAD 8SOP. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25LQ32DSIGR
- Description：IC FLASH 32MBIT SPI/QUAD 8SOP
- Series：-
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR),Cut Tape (CT)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR
- Memory Size：32Mbit
- Memory Organization：4M x 8
- Memory Interface：SPI - Quad I/O
- Clock Frequency：120 MHz
- Write Cycle Time - Word, Page：2.4ms
- Voltage - Supply：1.65V ~ 2V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-SOIC (0.209", 5.30mm Width)
- Supplier Device Package：8-SOP
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25LQ32DSIGR
Memory IC Overview
The GD25LQ32DSIGR is a 32M-bit (4M x 8) NOR flash memory manufactured by GigaDevice. It operates on a single 1.65V to 2.0V power supply and features a uniform sector architecture with 4K-byte sectors and 32/64K-byte blocks. The device supports standard, dual, quad SPI, and QPI interfaces with a maximum clock frequency of 120MHz. It is housed in an SOP-8 package and rated for industrial temperatures ranging from -40°C to +85°C.
Memory IC Feature Summary
- Supports standard, dual, quad SPI, and QPI modes for flexible data transfer rates
- Features uniform sector architecture allowing granular erase operations
- Includes hardware and software write protection mechanisms via WP# pin and status register bits
- Provides advanced security features including unique ID and OTP security registers
Memory IC Applications
- Code storage for microcontrollers requiring Execute-In-Place (XIP)
- BIOS or firmware storage in embedded systems
- Configuration data storage in consumer electronics
- Industrial control system memory modules
Memory IC Procurement Notes
Verify the specific suffix 'GR' indicates tape and reel packaging when ordering. Confirm the component is suitable for new designs as some distributors may list it as NRND. Ensure voltage levels match the 1.65V to 2.0V requirement. Check for moisture sensitivity handling requirements during assembly.
Memory IC Selection Notes
Select this part for applications requiring low-voltage operation and high-speed read access. Consider the SOP-8 package size constraints. Evaluate if the 32M-bit density meets storage needs compared to other densities in the GD25LQ32D series. Verify interface compatibility with the host controller's SPI capabilities.
Memory IC Part Context
This component belongs to the GD25LQ32D series of 1.8V uniform sector dual and quad serial flash memories. It shares core electrical characteristics with variants like GD25LQ32DSIG and GD25LQ32DLIGR, differing primarily in packaging and shipping format. The series is designed for cost-effective, high-reliability non-volatile storage solutions.
Memory IC Replacement Considerations
GD25LQ32DSIG offers identical electrical specifications but uses tube packaging instead of tape and reel.
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