Memory IC GD25LQ32ENAGR product image

GD25LQ32ENAGR

$0.96
  • Description:IC FLASH 32MBIT SPI/QUAD 8USON
  • Series:GD25LQ
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:07e597a2e07e Category: Brand:

  
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GD25LQ32ENAGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 32MBIT SPI/QUAD 8USON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LQ32ENAGR

  • Description:IC FLASH 32MBIT SPI/QUAD 8USON
  • Series:GD25LQ
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:32Mbit
  • Memory Organization:4M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:100µs, 4ms
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-UDFN Exposed Pad
  • Supplier Device Package:8-USON (3x4)
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LQ32ENAGR

GD25LQ32ENAGR

Memory IC Overview

The GD25LQ32ENAGR is a 32 Mbit SPI NOR Flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 1.65 V to 3.6 V and supports standard SPI and Quad I/O interfaces with clock frequencies up to 104 MHz. The component utilizes an 8-pin SOP package and is designed for non-volatile code storage in embedded systems.

Memory IC Feature Summary

  • Supports high-speed data transfer via standard SPI and Quad I/O modes
  • Operates on a wide voltage range suitable for diverse power environments
  • Provides reliable non-volatile storage for firmware and application code

Memory IC Applications

  • Consumer electronics devices requiring compact code storage
  • Industrial control systems needing reliable program memory
  • IoT modules utilizing low-power embedded architectures

Memory IC Procurement Notes

Verify the specific suffix ENAGR against official datasheets to confirm package type and temperature grade. Ensure compatibility with system voltage requirements before integration. Confirm availability status directly with authorized distributors as stock levels fluctuate. Validate RoHS compliance documentation for regulatory adherence in target markets.

Memory IC Selection Notes

Select this component when a 32 Mbit capacity is required for code execution or data storage. Consider the SOP-8 package for standard surface-mount assembly processes. Evaluate the 1.65 V to 3.6 V operating range against the target system's power rails. Compare performance metrics with other GD25 series variants if higher density or different interface speeds are needed.

Memory IC Part Context

This part belongs to the GD25LQ series, which focuses on low-power consumption and high reliability. The series targets applications demanding extended battery life and stable operation in consumer and industrial sectors. It complements GigaDevice's broader portfolio of SPI NOR Flash solutions ranging from smaller densities to larger capacities.

Memory IC Replacement Considerations

Check for direct pin-compatible substitutes within the GD25LQ family that offer identical memory density. Verify that alternative parts support the same voltage range and interface speeds. Consult manufacturer cross-reference lists for validated replacements ensuring functional equivalence.

GD25LQ32ENAGRGD25LQ32ENAGR
$0.96
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