GD25LQ32ENIGR

Memory IC Overview

The GD25LQ32ENIGR is a 32Mbit (4M x 8) NOR Flash memory IC manufactured by GigaDevice. It features SPI and Quad I/O interfaces with QPI support, operating at a clock frequency of 133 MHz and an access time of 7 ns. The device operates on a supply voltage range of 1.65V to 2V and supports word write cycles of 60µs and page writes of 2.4ms. It is housed in an 8-USON (4x3mm) package with exposed pad, suitable for surface mount applications across a temperature range of -40°C to +85°C.

Memory IC Feature Summary

• Supports standard SPI, Quad I/O, and QPI modes for flexible interface compatibility
• Operates within a low voltage range of 1.65V to 2V for power efficiency
• Provides high-speed data access with 133 MHz clock frequency capability
• Includes hardware write protection mechanisms for data security

Memory IC Applications

• Portable consumer electronics requiring low-voltage operation
• Embedded systems utilizing serial flash storage
• Firmware storage for microcontrollers and SoCs
• Industrial control devices operating in extended temperature ranges

Memory IC Procurement Notes

Verify the specific suffix 'ENIGR' against the official datasheet to confirm the 8-USON package and 1.65V-2V voltage range. Ensure that the ordering quantity aligns with manufacturer reel specifications. Confirm RoHS3 compliance status if required for your assembly process. Cross-reference the exact part number with distributor catalogs to avoid confusion with similar GD25LQ32 variants.

Memory IC Selection Notes

Select this component when a low-voltage (1.65V-2V) NOR Flash is required for space-constrained designs. The 8-USON package offers a compact footprint compared to standard SOP options. Consider the 133 MHz speed for applications needing rapid code execution from flash. Verify thermal requirements against the -40°C to +85°C operating range before finalizing the design.

Memory IC Part Context

This part belongs to the GD25LQ32E series of NOR Flash memories. It shares core architectural similarities with other members like GD25LQ32ESIGR but differs in packaging and potentially minor electrical characteristics. The series is designed for cost-effective, high-density storage solutions in portable and industrial markets.

Memory IC Replacement Considerations

GD25LQ32ESIGR: Similar electrical specs but in 8-SOP package. GD25LQ32EEIG: Similar specs but in USON-8 package without exposed pad. Verify pinout and physical dimensions before substitution.