Memory IC GD25LQ32ESIGY product image

GD25LQ32ESIGY

$0.52
  • Description:IC FLASH 32MBIT SPI/QUAD 8SOP
  • Series:GD25LQ
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray

SKU:ddc68bbaca67 Category: Brand:

  
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GD25LQ32ESIGY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 32MBIT SPI/QUAD 8SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LQ32ESIGY

  • Description:IC FLASH 32MBIT SPI/QUAD 8SOP
  • Series:GD25LQ
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:32Mbit
  • Memory Organization:4M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:60µs, 2.4ms
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.209", 5.30mm Width)
  • Supplier Device Package:8-SOP
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LQ32ESIGY

GD25LQ32ESIGY

Memory IC Overview

The GD25LQ32ESIGY is a 32 Mbit NOR flash memory IC manufactured by GigaDevice. It utilizes SPI and Quad I/O interfaces with QPI support, operating at a maximum clock frequency of 133 MHz and an access time of 7 ns. The device features a 4M x 8 organization within an 8-SOP package. It functions on a supply voltage range of 1.65 V to 2 V and supports industrial temperatures from -40°C to +85°C.

Memory IC Feature Summary

  • Supports high-speed SPI and Quad I/O communication modes including QPI for efficient data transfer.
  • Provides non-volatile storage using SLC NAND technology for reliable code execution.
  • Operates within a low voltage range suitable for portable and battery-powered applications.

Memory IC Applications

  • Firmware storage in embedded systems
  • Code execution in XIP (eXecute-In-Place) architectures
  • Data logging in industrial control units

Memory IC Procurement Notes

Verify the specific suffix 'GY' against the official manufacturer datasheet to confirm package dimensions and tape/reel specifications. Ensure compatibility with existing PCB footprints for the 8-SOP configuration. Confirm RoHS compliance status through current environmental certificates before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 32 Mbit capacity is required with strict low-voltage operation constraints. The 133 MHz speed rating suits applications needing faster boot times compared to standard SPI flashes. Verify that the system design accommodates the 1.65 V minimum supply requirement for stable performance across the full temperature range.

Memory IC Part Context

This part belongs to the GD25LQ32E series of NOR flash memories. It shares core electrical characteristics with variants like GD25LQ32ESIGR but differs in packaging or regional distribution specifics. The series is designed for cost-effective storage solutions in consumer electronics and IoT devices requiring moderate density and speed.

Memory IC Replacement Considerations

GD25LQ32ESIGR is listed as a parameter-equivalent alternative within the same series. Verify pinout compatibility and package tolerance differences between SOP variants before substitution.

GD25LQ32ESIGYGD25LQ32ESIGY
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