Memory IC GD25LQ32EWIGR product image

GD25LQ32EWIGR

$1.00
  • Description:IC FLASH 32MBIT SPI/QUAD 8WSON
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:53f2b4ff9ac8 Category: Brand:

  
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GD25LQ32EWIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 32MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LQ32EWIGR

  • Description:IC FLASH 32MBIT SPI/QUAD 8WSON
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:32Mbit
  • Memory Organization:4M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:60µs, 2.4ms
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-WDFN Exposed Pad
  • Supplier Device Package:8-WSON (5x6)
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LQ32EWIGR

GD25LQ32EWIGR

Memory IC Overview

The GD25LQ32EWIGR is a 32 Mbit NOR flash memory device manufactured by GigaDevice. It utilizes an SPI interface with support for Quad I/O and QPI modes, operating at a maximum clock frequency of 133 MHz. The component features a 4 M x 8 organization with an 8-bit data bus width. It operates within a supply voltage range of 1.65 V to 2 V and supports surface mount installation in a WSON-8 package. The active read current is specified at a maximum of 15 mA, and the device functions reliably across an industrial temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Supports standard SPI, Quad I/O, and QPI interfaces for flexible communication options.
  • Operates on a low voltage supply range suitable for power-constrained applications.
  • Provides non-volatile storage with high-speed serial access capabilities.

Memory IC Applications

  • Embedded systems requiring code execution directly from memory
  • Storage for firmware and boot code in consumer electronics
  • Data logging applications in industrial control environments

Memory IC Procurement Notes

Verify the specific suffix 'WIGR' against the manufacturer's official datasheet to confirm the exact package type and tape/reel specifications. Ensure that the 1.65 V to 2 V supply voltage requirement aligns with your system design, as this differs from standard 3.3 V variants. Confirm moisture sensitivity level handling procedures during assembly to prevent damage.

Memory IC Selection Notes

Select this part when a low-voltage operation between 1.65 V and 2 V is required, distinguishing it from the 2.7 V to 3.6 V GD25Q series. The WSON-8 package offers a compact footprint compared to SOP-8 alternatives. Consider the 133 MHz clock speed for performance needs, noting that other variants may offer different speeds or voltage tolerances.

Memory IC Part Context

This component belongs to the GD25LQ32E series of NOR flash memories. It shares the base 32 Mbit capacity and SPI interface with siblings like the GD25LQ32ETIGR, but differs in packaging and potentially electrical characteristics. The 'W' in the suffix typically denotes the WSON package, while 'I' indicates the industrial temperature range.

Memory IC Replacement Considerations

GD25LQ32ETIGR: Similar electrical specs but uses SOP-8 package. GD25Q32EWIGR: Same package but requires 2.7 V to 3.6 V supply voltage. Verify pin compatibility and voltage levels before substitution.

GD25LQ32EWIGRGD25LQ32EWIGR
$1.00
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