GD25LQ32EWJGR

Memory IC Overview

The GD25LQ32EWJGR is a 32 Mbit NOR flash memory device manufactured by GigaDevice. It features a WSON-8 surface-mount package and supports Dual/Quad SPI, QPI, and standard SPI interfaces with a maximum clock frequency of 133 MHz. The storage organization is 4 M x 8 bits with an 8-bit data bus width. Operating voltage ranges from 1.65 V to 2 V, with a maximum active read current of 15 mA. The component operates within a temperature range of -40°C to +105°C.

Memory IC Feature Summary

• Supports high-speed Quad I/O and QPI modes for enhanced data throughput
• Provides flexible interface compatibility including standard SPI and Dual SPI modes
• Operates within an extended industrial temperature range up to +105°C

Memory IC Applications

• Industrial control systems requiring wide temperature operation
• Embedded firmware storage in consumer electronics
• IoT devices utilizing low-voltage power supplies

Memory IC Procurement Notes

Verify the specific suffix JGR against official datasheets to confirm the exact temperature grade and package variant. Confirm RoHS compliance status and moisture sensitivity level requirements for your assembly process. Check availability through authorized distributors as supply constraints may affect lead times. Ensure ESD handling procedures are followed during installation.

Memory IC Selection Notes

Select this part when an extended commercial or industrial temperature range up to +105°C is required alongside a compact WSON-8 footprint. Compare against variants like EWIGR if a lower temperature limit of +85°C is sufficient, as this may offer different availability. Ensure the system design supports the 1.65V to 2V supply rail and utilizes compatible SPI controller logic for Quad mode operations.

Memory IC Part Context

This component belongs to the GD25LQ32 family of 32 Mbit NOR flash memories. Variants such as GD25LQ32EWIGR share similar electrical characteristics but differ in operating temperature specifications. The family generally offers non-volatile storage solutions for code execution and data retention in embedded applications.

Memory IC Replacement Considerations

GD25LQ32EWIGR shares identical electrical parameters but differs in maximum operating temperature (+85°C vs +105°C). Verify thermal requirements before substitution. Other family members like GD25LQ32ENIGR use USON-8 packaging, which requires PCB layout adjustments.