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GD25LQ40CTIG is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 4MBIT SPI/QUAD I/O 8SOP. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25LQ40CTIG
- Description：IC FLASH 4MBIT SPI/QUAD I/O 8SOP
- Series：-
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tube
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR
- Memory Size：4Mbit
- Memory Organization：512K x 8
- Memory Interface：SPI - Quad I/O
- Clock Frequency：104 MHz
- Write Cycle Time - Word, Page：50µs, 2.4ms
- Voltage - Supply：1.65V ~ 2.1V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package：8-SOP
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25LQ40CTIG
Memory IC Overview
The GD25LQ40CTIG is a non-volatile NOR flash memory integrated circuit manufactured by GigaDevice. It features a storage capacity of 4 Megabits organized as 512K x 8 bits. The device utilizes an SPI Quad I/O interface with a maximum clock frequency of 104 MHz. It operates within a supply voltage range of 1.65V to 2.1V and supports an industrial temperature range from -40°C to +85°C. The component is housed in an 8-SOP surface-mount package.
Memory IC Feature Summary
- Supports standard, dual, and quad SPI communication modes for flexible data transfer
- Provides uniform sector architecture for consistent erase and write operations
- Operates at low voltage levels suitable for power-efficient embedded systems
Memory IC Applications
- Industrial control system firmware storage
- Consumer electronics code execution
- Embedded device configuration retention
Memory IC Procurement Notes
Verify the specific suffix 'IGR' against the requested part number 'GD25LQ40CTIG'. Datasheets indicate 'IGR' denotes tape-and-reel packaging, while the base model may imply tube packaging. Confirm package type and moisture sensitivity level requirements match the intended manufacturing process before ordering.
Memory IC Selection Notes
Select this component when a 4Mbit density is required with low-voltage operation between 1.65V and 2.1V. Ensure the design supports SPI Quad I/O interfaces. Verify that the 8-SOP package dimensions fit the PCB layout constraints and that the industrial temperature rating meets environmental specifications.
Memory IC Part Context
This part belongs to the GD25LQ series of low-voltage SPI NOR flash memories. It shares architectural similarities with other members like the GD25LQ16CTIG but differs in storage capacity. The series is designed for applications requiring reliable code execution and data storage in compact form factors.
Memory IC Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided documentation. Cross-reference with GD25LQ40 variants only if packaging or suffix differences are acceptable.
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