Memory IC GD25LQ64CSIGR product image

GD25LQ64CSIGR

$1.18
  • Description:IC FLASH 64MBIT SPI/QUAD 8SOP
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:965d72d998c7 Category: Brand:

  
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GD25LQ64CSIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 64MBIT SPI/QUAD 8SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LQ64CSIGR

  • Description:IC FLASH 64MBIT SPI/QUAD 8SOP
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:64Mbit
  • Memory Organization:8M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:120 MHz
  • Write Cycle Time - Word, Page:2.4ms
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.209", 5.30mm Width)
  • Supplier Device Package:8-SOP
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LQ64CSIGR

GD25LQ64CSIGR

Memory IC Overview

The GD25LQ64CSIGR is a 64 Mbit (8 M x 8) SPI NOR Flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 1.65 V to 2 V and supports standard, dual, and quad SPI interfaces with a maximum clock frequency of 120 MHz. The component utilizes an 8-SOP package and is rated for industrial operating temperatures ranging from -40°C to +85°C. It features uniform sector architecture for flexible data storage management.

Memory IC Feature Summary

  • Supports Dual and Quad I/O modes for enhanced data throughput via the SPI interface.
  • Features uniform sector architecture allowing consistent erase block sizes across the memory array.
  • Operates at low voltage levels suitable for power-constrained embedded applications.

Memory IC Applications

  • Storage of firmware and boot code in low-voltage embedded systems
  • Configuration data storage in portable consumer electronics
  • Code execution in place (XIP) applications requiring small form factors

Memory IC Procurement Notes

Verify the specific suffix 'IGR' corresponds to the required tape-and-reel packaging configuration for automated assembly processes. Confirm that the 1.65 V to 2 V operating voltage aligns with the target system's power rail specifications. Ensure compatibility with the 8-SOP footprint during PCB layout finalization. Check for any RoHS compliance documentation if required by regional regulations.

Memory IC Selection Notes

Select this component when a 64 Mbit capacity is required alongside strict low-voltage operation constraints between 1.65 V and 2 V. The 120 MHz clock speed provides adequate performance for moderate-speed data access needs. Consider the 8-SOP package dimensions against available board space. Verify that the industrial temperature range meets environmental requirements for the intended deployment scenario.

Memory IC Part Context

This part belongs to the GD25LQ64 series of serial flash memories designed for low-voltage applications. It shares architectural similarities with other members of the family but is distinguished by its specific voltage range and package type. The series targets markets demanding high-density storage in compact, energy-efficient devices.

Memory IC Replacement Considerations

GD25LQ64ESIGR is identified as a manufacturer-recommended alternative. Verify pinout and electrical parameter compatibility before substitution.

GD25LQ64CSIGRGD25LQ64CSIGR
$1.18
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