Memory IC GD25LQ64EBAGY product image

GD25LQ64EBAGY

$1.27
  • Description:IC FLASH
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray

SKU:5b3b07e9c19b Category: Brand:

  
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GD25LQ64EBAGY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LQ64EBAGY

  • Description:IC FLASH
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray
  • Memory Type:-
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:-
  • Memory Organization:-
  • Memory Interface:-
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:-
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LQ64EBAGY

GD25LQ64EBAGY

Memory IC Overview

The GD25LQ64EBAGY is a 64 Mbit (8 M x 8) SPI NOR Flash memory component manufactured by GigaDevice. It operates within a supply voltage range of 1.65 V to 2 V and supports a maximum clock frequency of 133 MHz. The device utilizes an 8-bit data bus width and is housed in a TFBGA-24 surface-mount package. It functions reliably across a temperature range of -40°C to +85°C, providing non-volatile storage for embedded systems requiring low-voltage operation.

Memory IC Feature Summary

  • Supports standard SPI and Quad SPI interfaces for flexible data transfer modes
  • Operates at low supply voltages suitable for battery-powered applications
  • Includes hardware and software reset capabilities for system stability

Memory IC Applications

  • Embedded firmware storage in IoT devices
  • Configuration data retention in consumer electronics
  • Code execution in place (XIP) for microcontrollers

Memory IC Procurement Notes

Verify the specific suffix 'BAGY' against official GigaDevice documentation to confirm pinout and electrical characteristics. Ensure compatibility with the target board's TFBGA-24 footprint and reflow profile. Confirm moisture sensitivity levels and recommended storage conditions prior to assembly to prevent package damage during soldering processes.

Memory IC Selection Notes

Select this component when a 64 Mbit capacity is required with a strict 1.65 V to 2 V operating voltage constraint. The TFBGA-24 package offers a compact solution for space-constrained designs. Verify that the host controller supports the necessary SPI command set and clock speeds up to 133 MHz for optimal performance.

Memory IC Part Context

This part belongs to the GD25LQ64E series of SPI NOR Flash memories from GigaDevice. The series is designed for high-reliability applications with features such as write protection and sector erase capabilities. It complements other variants in the family that may offer different packages or voltage ranges, providing designers with options for various form factors and power requirements.

Memory IC Replacement Considerations

Check for direct substitutes within the GD25LQ64E series with compatible packages. Cross-reference with other manufacturers offering 64 Mbit SPI NOR Flash in TFBGA-24 packages, ensuring identical voltage and interface specifications before substitution.

GD25LQ64EBAGYGD25LQ64EBAGY
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