GD25LQ64ENJGR

$0.88

Description：IC FLASH 64MBIT SPI/QUAD 8USON
Series：GD25LQ
Mfr：GigaDevice Semiconductor (HK) Limited
Package：Tape & Reel (TR)

SKU:340b3a1f4de9 Category: Memory IC Brand: GigaDevice Semiconductor (HK) Limited

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Product introduction

GD25LQ64ENJGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 64MBIT SPI/QUAD 8USON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LQ64ENJGR

Description：IC FLASH 64MBIT SPI/QUAD 8USON
Series：GD25LQ
Mfr：GigaDevice Semiconductor (HK) Limited
Package：Tape & Reel (TR)
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NOR (SLC)
Memory Size：64Mbit
Memory Organization：8M x 8
Memory Interface：SPI - Quad I/O, QPI
Clock Frequency：133 MHz
Write Cycle Time - Word, Page：60µs, 2.4ms
Voltage - Supply：1.65V ~ 2V
Operating Temperature：-40°C ~ 105°C (TA)
Mounting Type：Surface Mount
Package / Case：8-UDFN Exposed Pad
Supplier Device Package：8-USON (3x4)
Access Time：6 ns
Grade：-
Qualification：-

Memory IC datasheet and documents for GD25LQ64ENJGR

GD25LQ64ENJGR

Memory IC Overview

The GD25LQ64ENJGR is a 64 Mbit NOR flash memory device manufactured by GigaDevice. It features an SPI interface with support for Quad I/O operations and achieves a maximum clock frequency of 166 MHz. The component operates within a supply voltage range of 1.65 V to 2 V and is housed in an USON-8 package. It supports surface mount installation and functions reliably across a temperature range of -40°C to +105°C.

Memory IC Feature Summary

Supports high-speed SPI communication with Quad I/O modes for efficient data transfer
Operates at low voltage levels suitable for portable and battery-powered applications
Provides robust performance across extended industrial temperature ranges

Memory IC Applications

Industrial control systems requiring reliable non-volatile storage
Consumer electronics utilizing low-power embedded memory
Automotive infotainment and instrument cluster modules

Memory IC Procurement Notes

Verify the specific suffix JGR against official datasheets to confirm package dimensions and tape/reel specifications. Ensure compatibility with existing PCB footprints for USON-8 components. Check for moisture sensitivity level requirements during assembly. Confirm RoHS compliance status with current manufacturer documentation before finalizing procurement orders.

Memory IC Selection Notes

Select this part when a compact USON-8 footprint is required alongside extended temperature capabilities up to 105°C. Compare against standard SOIC packages if space constraints are critical. Verify that the 1.65V to 2V operating voltage aligns with the system power rail. Consider the 166 MHz speed capability for high-throughput application needs.

Memory IC Part Context

This component belongs to the GD25LQ64 series, which offers various package options including WSON and SOP variants. The ENJGR designation specifically indicates the USON-8 packaging configuration. This series is designed for general-purpose code storage in embedded systems where size and power efficiency are prioritized over raw capacity.