Memory IC GD25LQ64EQIGR product image

GD25LQ64EQIGR

$0.75
  • Description:IC FLASH 64MBIT SPI/QUAD 8USON
  • Series:GD25LQ
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:f774842b337c Category: Brand:

  
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GD25LQ64EQIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 64MBIT SPI/QUAD 8USON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LQ64EQIGR

  • Description:IC FLASH 64MBIT SPI/QUAD 8USON
  • Series:GD25LQ
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:64Mbit
  • Memory Organization:8M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:60µs, 2.4ms
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-XDFN Exposed Pad
  • Supplier Device Package:8-USON (4x4)
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LQ64EQIGR

GD25LQ64EQIGR

Memory IC Overview

The GD25LQ64EQIGR is a NOR flash memory component manufactured by GigaDevice. It provides a storage capacity of 64 Mbit organized as 8 M x 8 bits. The device utilizes an SPI interface with a maximum clock frequency of 133 MHz. It operates within a supply voltage range of 1.65 V to 2 V and supports active read currents up to 15 mA. The unit is housed in a USON-8 surface-mount package and functions reliably across a temperature range of -40°C to +85°C.

Memory IC Feature Summary

  • Supports standard Serial Peripheral Interface (SPI) communication protocols for data transfer.
  • Features low-voltage operation capabilities suitable for power-constrained embedded systems.
  • Utilizes a compact USON-8 surface-mount package design for efficient board space utilization.

Memory IC Applications

  • Embedded firmware storage in consumer electronics
  • Configuration data retention in industrial control modules
  • Code execution storage in IoT sensor nodes

Memory IC Procurement Notes

Verify the specific suffix 'IGR' against official manufacturer documentation to confirm package type and tape-and-reel specifications. Ensure compatibility with system voltage requirements, as this model operates at 1.65V to 2V. Confirm moisture sensitivity level handling procedures during assembly to prevent damage. Cross-reference the exact part number with current datasheets to validate pinout and electrical characteristics before integration.

Memory IC Selection Notes

Select this component when a small form factor is required alongside low-power operation constraints. The USON-8 package offers a footprint advantage over traditional SOP or WSON variants. Ensure the host controller supports the necessary SPI modes and voltage levels. Consider thermal management requirements given the operating temperature range limits. Verify that the 64 Mbit capacity aligns with application storage needs without excessive overhead.

Memory IC Part Context

This part belongs to the GD25LQ64E series of NOR flash memories from GigaDevice. The series shares core architectural features but varies in packaging and environmental ratings. Other variants include SOP-8 and WSON-8 packages with similar electrical specifications. The 'E' designation typically indicates specific manufacturing revisions or enhanced reliability standards within the product line.

Memory IC Replacement Considerations

GD25LQ64EWIGR is a manufacturer-recommended substitute offering identical functionality in an 8-WSON package. Verify pin-to-pin compatibility and ensure the alternative package fits the existing PCB layout constraints. Check for any minor differences in timing parameters or power consumption profiles between the USON-8 and WSON-8 versions.

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