Memory IC GD25LQ64EWAGR product image

GD25LQ64EWAGR

$1.28
  • Description:IC FLASH 64MBIT SPI/QUAD 8WSON
  • Series:GD25LQ
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:188bae6b07aa Category: Brand:

  
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GD25LQ64EWAGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 64MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LQ64EWAGR

  • Description:IC FLASH 64MBIT SPI/QUAD 8WSON
  • Series:GD25LQ
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:64Mbit
  • Memory Organization:8M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:100µs, 4ms
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-WDFN Exposed Pad
  • Supplier Device Package:8-WSON (5x6)
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LQ64EWAGR

GD25LQ64EWAGR

Memory IC Overview

The GD25LQ64EWAGR is a 64 Mbit SPI NOR Flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 1.65 V to 2 V and supports SPI interfaces including Quad I/O and QPI modes. The component features a maximum clock frequency of 166 MHz, with an access time of 6 ns. It utilizes an 8-WSON (5x6) package for surface mount installation. The device ensures data retention and endurance suitable for embedded applications, functioning reliably across a temperature range of -40°C to +125°C.

Memory IC Feature Summary

  • Supports high-speed serial peripheral interface operations with Quad I/O and QPI capabilities for efficient data throughput.
  • Engineered for extended industrial temperature operation ranging from -40°C to +125°C.
  • Utilizes a compact 8-WSON surface-mount package design.

Memory IC Applications

  • Industrial control systems requiring wide temperature tolerance
  • Embedded storage in consumer electronics
  • IoT devices utilizing low-voltage power supplies

Memory IC Procurement Notes

Verify the specific suffix 'AGR' against the manufacturer's official datasheet to confirm the exact tape-and-reel packaging configuration and moisture sensitivity level. Ensure the 1.65V to 2V voltage domain aligns with the target system design, as this variant differs from standard 3V parts. Confirm lead times and minimum order quantities directly with authorized distributors or the manufacturer, as these parameters are subject to change based on production schedules.

Memory IC Selection Notes

Select this part when a low-voltage 1.65V to 2V supply is required alongside industrial-grade temperature ratings. The 64 Mbit density fits applications needing moderate code storage. Compare against the GD25LQ64ENIGR if a USON-8 package or different thermal profile is preferred. Verify that the 166 MHz clock speed meets the system bus requirements. Ensure the WSON-8 footprint matches the PCB layout constraints.

Memory IC Part Context

This component belongs to the GD25LQ series of SPI NOR Flash memories from GigaDevice. The series is characterized by its support for various voltage domains and interface speeds. The GD25LQ64EWAGR specifically targets low-voltage applications with industrial temperature specifications, distinguishing it from automotive-grade variants which may carry additional functional safety certifications like AEC-Q100.

Memory IC Replacement Considerations

GD25LQ64EWIGR: Identical electrical specifications but potentially different packaging or trailing zeros in the suffix. GD25LQ64ENIGR: Similar capacity and voltage but uses an 8-USON package instead of WSON-8. Verify pin compatibility and thermal characteristics before substitution.

GD25LQ64EWAGRGD25LQ64EWAGR
$1.28
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