Memory IC GD25LQ80CSIGR product image

GD25LQ80CSIGR

  • Description:IC FLASH 8MBIT SPI/QUAD I/O 8SOP
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:16b41af36bfa Category: Brand:

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GD25LQ80CSIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 8MBIT SPI/QUAD I/O 8SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LQ80CSIGR

  • Description:IC FLASH 8MBIT SPI/QUAD I/O 8SOP
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:8Mbit
  • Memory Organization:1M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:104 MHz
  • Write Cycle Time - Word, Page:50µs, 2.4ms
  • Voltage - Supply:1.65V ~ 2.1V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.209", 5.30mm Width)
  • Supplier Device Package:8-SOP
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LQ80CSIGR

GD25LQ80CSIGR

Memory IC Overview

The GD25LQ80CSIGR is an 8M-bit (1M x 8) NOR flash memory manufactured by GigaDevice. It operates on a single 1.65V to 2.1V power supply and features a uniform sector architecture with 4K-byte sectors and 32/64K-byte blocks. The device supports standard, dual, and quad SPI interfaces, achieving a maximum clock frequency of 104MHz for fast read operations. It is housed in an SOP-8 package and rated for industrial temperatures ranging from -40°C to +85°C.

Memory IC Feature Summary

  • Supports Dual and Quad Serial Peripheral Interface (SPI) modes for high-speed data transfer up to 416Mbits/s.
  • Features uniform sector architecture allowing flexible software and hardware write protection via Block Protect bits.
  • Includes advanced security capabilities such as 128-bit unique identification and three 512-byte one-time programmable security registers.
  • Designed for low power consumption with typical standby current of 9uA and deep power-down current of 1uA.

Memory IC Applications

  • Firmware storage in consumer electronics devices
  • Code execution in place (XIP) applications
  • Industrial control systems requiring wide temperature operation
  • IoT modules and embedded systems

Memory IC Procurement Notes

Verify the specific suffix 'GR' indicates tape and reel packaging when sourcing. Confirm the component status is suitable for your design lifecycle, as some variants may be marked Not Recommended for New Designs. Ensure voltage levels match the 1.65V to 2.1V requirement strictly, as this model is not compatible with 3.3V systems.

Memory IC Selection Notes

Select this part for designs requiring low-voltage operation (1.8V domain) rather than standard 3.3V NOR flashes. Consider the SOP-8 package dimensions if board space is constrained. Verify that the host controller supports the required Dual/Quad SPI commands if high-speed read performance is necessary for the application.

Memory IC Part Context

This component belongs to the GD25LQ80C series, which focuses on 1.8V uniform sector serial flash memories. It shares architectural similarities with other GD25Q series parts but differs in operating voltage and interface speed specifications. The GD25LQ80C is distinct from NAND flash products offered by the same manufacturer.

Memory IC Replacement Considerations

GD25LQ80CN2GR

Memory IC FAQ

What is the difference between the WP# and HOLD# pins in Quad SPI mode?

In Quad SPI mode, the WP# pin functions as IO2 and the HOLD# pin functions as IO3, enabling four bidirectional data lines for faster communication.

How is the memory protected against unintended writes?

Protection is achieved through software commands like WREN/WRDI and hardware signals like WP#. Additionally, Block Protect bits allow locking specific memory regions.

GD25LQ80CSIGRGD25LQ80CSIGR

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