GD25LR256EB2RY

$3.46

Description：IC FLSH 256MBIT SPI/QUAD 24TFBGA
Series：GD25LR
Mfr：GigaDevice Semiconductor (HK) Limited
Package：Tray

SKU:c8ec4189d8e9 Category: Memory IC Brand: GigaDevice Semiconductor (HK) Limited

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Product introduction

GD25LR256EB2RY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLSH 256MBIT SPI/QUAD 24TFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LR256EB2RY

Description：IC FLSH 256MBIT SPI/QUAD 24TFBGA
Series：GD25LR
Mfr：GigaDevice Semiconductor (HK) Limited
Package：Tray
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NOR (SLC)
Memory Size：256Mbit
Memory Organization：32M x 8
Memory Interface：SPI - Quad I/O, QPI, DTR
Clock Frequency：-
Write Cycle Time - Word, Page：-
Voltage - Supply：1.65V ~ 2V
Operating Temperature：-40°C ~ 105°C (TA)
Mounting Type：Surface Mount
Package / Case：24-TBGA
Supplier Device Package：24-TFBGA (6x8)
Access Time：-
Grade：-
Qualification：-

Memory IC datasheet and documents for GD25LR256EB2RY

GD25LR256EB2RY

Memory IC Overview

The GD25LR256EB2RY is a 256Mbit SPI NOR Flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 1.65V to 2.0V and supports Single I/O, Quad I/O, QPI, and DTR interface modes. The component achieves frequencies of 104MHz in x1/x4 modes and 60MHz in x4 DTR mode. It is available in SOP16 (300mil), WSON8 (6x5mm and 8x6mm), and TFBGA24 (5x5mm) packages. Automotive-grade variants support temperature ranges of -40°C to 105°C or -40°C to 125°C.

Memory IC Feature Summary

Supports high-speed Quad I/O and Dual Data Rate (DTR) interfaces for enhanced data throughput.
Includes hardware reset functionality and write-protect pins for system reliability.
Features security registers with One-Time Programmable (OTP) locks for data protection.
Offers a unique identifier for device authentication and tracking.

Memory IC Applications

Automotive infotainment systems requiring AEC-Q100 qualification
Industrial control units needing high-reliability code storage
Consumer electronics devices utilizing low-voltage power supplies

Memory IC Procurement Notes

Verify the specific package suffix (e.g., B2RY for TFBGA24) against your board design requirements. Confirm whether the automotive grade (-40°C to 125°C) is required for your application environment. Ensure the 1.65V-2.0V voltage range aligns with your system's power rails. Request the official datasheet to validate pinout compatibility and electrical characteristics before finalizing procurement.

Memory IC Selection Notes

Select this part when a 256Mbit density is needed with strict low-voltage constraints between 1.65V and 2.0V. Choose the TFBGA24 package for space-constrained designs requiring the B2RY suffix. Consider the automotive-grade option if operating temperatures exceed 105°C. Verify that the host controller supports the desired interface modes, particularly DTR for maximum speed.

Memory IC Part Context

This component belongs to the GD25L series of SPI NOR Flash memories from GigaDevice. The series targets applications demanding high performance and low power consumption. It complements other densities in the portfolio, ranging from 512Kb to 2Gb, offering flexibility for various embedded storage needs across consumer, industrial, and automotive sectors.

Memory IC Replacement Considerations

Check for compatible parts within the GD25L family with matching density and voltage. Verify package footprint compatibility for direct replacements. Ensure interface protocol support matches the existing system design.