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GD25LR256FWIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 256MBIT SPI/QUAD. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25LR256FWIGR
- Description：IC FLASH 256MBIT SPI/QUAD
- Series：GD25LR
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：256Mbit
- Memory Organization：32M x 8
- Memory Interface：SPI - Quad I/O, QPI
- Clock Frequency：104 MHz
- Write Cycle Time - Word, Page：120µs, 1.2ms
- Voltage - Supply：1.65V ~ 2V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-WDFN Exposed Pad
- Supplier Device Package：8-WSON (5x6)
- Access Time：7 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25LR256FWIGR
Memory IC Overview
The GD25LR256FWIGR is a 256 Mbit NOR flash memory device manufactured by GigaDevice. It features a Dual/Quad SPI interface with a maximum clock frequency of 104 MHz. The storage organization is 32 M x 8 bits. The component operates within a supply voltage range of 2.7 V to 3.6 V and supports an industrial temperature range from -40°C to +85°C. It is housed in an 8-WSON package.
Memory IC Feature Summary
- Supports Dual and Quad SPI interfaces for high-speed data transfer
- Designed for automotive-grade reliability and functional safety
- Includes hardware write protection and absolute write protection mechanisms
Memory IC Applications
- Automotive infotainment systems
- Industrial control applications
- Medical devices
- Aerospace electronics
Memory IC Procurement Notes
Verify the specific suffix 'WIGR' against the official datasheet to confirm the package type and tape-and-reel specifications. Ensure the selected variant meets the required AEC-Q100 qualification level if used in automotive contexts. Cross-reference the manufacturer's latest documentation to confirm availability and any potential obsolescence notices before finalizing procurement plans.
Memory IC Selection Notes
Select this component when a 256 Mbit density is required with automotive-grade reliability standards. It is suitable for designs needing Dual/Quad SPI support at frequencies up to 104 MHz. Consider this part for industrial or medical applications requiring operation across the full -40°C to +85°C temperature range with robust write protection features.
Memory IC Part Context
This part belongs to the GD25LR series, which targets automotive and industrial markets. It complements other GigaDevice NOR flash products like the GD25F and GD25Q series but offers enhanced reliability certifications. The series provides scalable solutions for code storage in embedded systems requiring high durability and safety compliance.
Memory IC Replacement Considerations
GD25LR256FYIGR is a confirmed substitute with similar specifications. Verify pin compatibility and electrical characteristics against the original datasheet before substitution.
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