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GD25LT256EBIRY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLSH 256MBIT SPI/QUAD 24TFBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25LT256EBIRY
- Description：IC FLSH 256MBIT SPI/QUAD 24TFBGA
- Series：-
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR
- Memory Size：256Mbit
- Memory Organization：32M x 8
- Memory Interface：SPI - Quad I/O, QPI, DTR
- Clock Frequency：200 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：1.65V ~ 2V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：24-TBGA
- Supplier Device Package：24-TFBGA (6x8)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25LT256EBIRY
Memory IC Overview
The GD25LT256EBIRY is a 256 Mbit NOR flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 1.65 V to 2 V and features a 32 M x 8 organization with an 8-bit data bus width. The component supports SPI, Quad I/O, QPI, and DTR interfaces, achieving a maximum clock frequency of 200 MHz. It is housed in a 24-TFBGA (6x8 mm) package designed for surface mount installation. The device is rated for industrial operating temperatures ranging from -40°C to +85°C.
Memory IC Feature Summary
- Supports high-speed data transfer via Quad SPI, QPI, and DTR interface modes.
- Provides non-volatile code storage suitable for system boot applications.
- Designed for industrial temperature environments ensuring operational stability.
Memory IC Applications
- Code storage for embedded systems requiring fast read access
- Industrial control units operating in wide temperature ranges
- IoT devices utilizing low-voltage power supplies
Memory IC Procurement Notes
Verify the specific suffix 'BIRY' against official datasheets to confirm the tray packaging configuration and industrial temperature grade. Ensure compatibility with 1.65V to 2V supply rails during design integration. Confirm moisture sensitivity level requirements for assembly processes.
Memory IC Selection Notes
Select this component when a 256 Mbit capacity is required alongside high-speed DTR or Quad SPI interfaces. It is appropriate for designs constrained by the 24-TFBGA footprint and 1.8V nominal voltage operation. Consider alternative packages if SOP-16 availability is preferred over BGA form factors.
Memory IC Part Context
This part belongs to the GD25LT256E series, representing GigaDevice's high-performance Quad SPI NOR flash solutions. The series maintains compatibility with existing standard SPI protocols while offering enhanced throughput capabilities for modern embedded applications.
Memory IC Replacement Considerations
GD25LB256EBJRY offers similar capacity but differs in maximum clock frequency and temperature rating. Verify interface compatibility and thermal specifications before substitution.
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