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GD25LT256EWIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 256MBIT SPI/QUAD. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25LT256EWIGR
- Description：IC FLASH 256MBIT SPI/QUAD
- Series：GD25LT
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：256Mbit
- Memory Organization：32M x 8
- Memory Interface：SPI - Quad I/O, QPI, DTR
- Clock Frequency：200 MHz
- Write Cycle Time - Word, Page：70µs, 1.2ms
- Voltage - Supply：1.65V ~ 2V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-WDFN Exposed Pad
- Supplier Device Package：8-WSON (5x6)
- Access Time：6 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25LT256EWIGR
Memory IC Overview
The GD25LT256EWIGR is a 256 Mbit SPI NOR flash memory IC manufactured by GigaDevice. It features a 32M x 8 organization and supports Quad I/O, QPI, and DTR interfaces with a maximum clock frequency of 200 MHz. The device operates within a supply voltage range of 1.65 V to 2 V and functions at temperatures between -40°C and +85°C. It is housed in a 24-TFBGA (6x8) package.
Memory IC Feature Summary
- Supports high-speed Quad SPI, QPI, and DTR interface modes for enhanced data throughput.
- Operates on low-voltage power supplies ranging from 1.65 V to 2 V.
- Provides industrial temperature range operation suitable for diverse environmental conditions.
Memory IC Applications
- High-performance embedded storage systems requiring fast access speeds
- Low-voltage portable electronic devices
- Industrial control applications operating in wide temperature ranges
Memory IC Procurement Notes
Verify the specific suffix 'BIRY' against official manufacturer documentation to confirm the exact package type and tape/reel specifications. Ensure compatibility with the required 1.65 V to 2 V power domain during system design. Confirm that the 24-TFBGA footprint matches the target PCB layout constraints before finalizing procurement orders.
Memory IC Selection Notes
Select this component when a 256 Mbit capacity is required alongside high-speed DTR or Quad SPI interfaces. It is appropriate for designs constrained by a 2V maximum supply voltage limit. The TFBGA package is suitable for space-constrained applications where surface mount technology is preferred over larger packages.
Memory IC Part Context
This part belongs to the GD25LT256E series of high-performance Quad SPI NOR flash memories. The series is designed to meet the demands of various applications requiring high speed and security features. It represents a specialized variant optimized for lower voltage operations compared to standard 3.3V counterparts.
Memory IC Replacement Considerations
GD25LT256EBIRY is a confirmed substitute part number listed in distributor records. Verify pinout and electrical characteristics match exactly before substitution.
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