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GD25LT256EY2GR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25LT256EY2GR
- Description：IC FLASH
- Series：-
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：-
- Memory Format：FLASH
- Technology：FLASH - NOR
- Memory Size：-
- Memory Organization：-
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25LT256EY2GR
Memory IC Overview
The GD25LT256EY2GR is a 256 Mbit SPI NOR Flash memory IC manufactured by GigaDevice. It features a 32M x 8 organization and supports Quad I/O, QPI, and DTR interfaces with clock frequencies up to 200 MHz. The device operates within a supply voltage range of 1.65 V to 2 V and functions across an industrial temperature range of -40°C to +85°C. It is housed in a compact WSON-8 package suitable for surface mount applications.
Memory IC Feature Summary
- Supports high-speed Quad I/O, QPI, and DTR interface modes for enhanced data throughput
- Operates on a low-voltage power supply ranging from 1.65 V to 2 V
- Designed for industrial-grade reliability with extended temperature tolerance
Memory IC Applications
- Embedded systems requiring non-volatile code storage
- Industrial control equipment
- Consumer electronics devices
Memory IC Procurement Notes
Verify the specific suffix Y2GR against official datasheets to confirm package type and tape-and-reel specifications. Ensure compatibility with system voltage requirements of 1.65 V to 2 V. Confirm that the target application supports the required interface modes including Quad I/O or DTR. Validate component authenticity through authorized distribution channels.
Memory IC Selection Notes
Select this component when a small WSON-8 footprint is required alongside high-speed data transfer capabilities. It is suitable for designs needing robust performance in industrial environments. Consider the 200 MHz clock speed for bandwidth-intensive operations. Ensure the PCB layout accommodates the specific pin configuration of the WSON-8 package.
Memory IC Part Context
This part belongs to the GD25LT256E series of SPI NOR Flash memories. The series is characterized by high performance and security features designed for diverse design requirements. GigaDevice utilizes advanced process technology to deliver reliable non-volatile storage solutions for various electronic applications.
Memory IC Replacement Considerations
Check for compatible parts within the same GD25LT256 family. Verify if alternative suffixes offer different packaging options while maintaining identical electrical characteristics. Ensure any substitute matches the 24-TFBGA or WSON-8 form factor if physical constraints apply.
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