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GD25LX256EB2RY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLSH 256MBIT SPI/OCTL 24TFBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25LX256EB2RY
- Description：IC FLSH 256MBIT SPI/OCTL 24TFBGA
- Series：GD25LX
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：256Mbit
- Memory Organization：32M x 8
- Memory Interface：SPI - Octal I/O, DTR
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：1.65V ~ 2V
- Operating Temperature：-40°C ~ 105°C (TA)
- Mounting Type：Surface Mount
- Package / Case：24-TBGA
- Supplier Device Package：24-TFBGA (6x8)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25LX256EB2RY
Memory IC Overview
The GD25LX256EB2RY is a 256 Mbit NOR flash memory device manufactured by GigaDevice. It features a 32M x 8 organization and supports SPI, Octal I/O, and DTR interfaces with a maximum clock frequency of 200 MHz. The component operates within a supply voltage range of 1.65 V to 2 V and functions at temperatures from -40°C to 105°C. It utilizes a 24-TFBGA (6x8) surface-mount package.
Memory IC Feature Summary
- Supports high-speed data transfer via Octal I/O and Double Data Rate (DTR) protocols for enhanced throughput.
- Designed for applications requiring rapid code execution and fast system boot-up times.
- Operates reliably across an extended industrial temperature range.
Memory IC Applications
- Automotive infotainment systems
- Artificial intelligence edge devices
- Internet of Things (IoT) modules
Memory IC Procurement Notes
Verify the specific suffix EB2RY against official datasheets to confirm the 24-TFBGA package and 105°C temperature grade. Confirm RoHS compliance status and moisture sensitivity level prior to assembly. Ensure design compatibility with the 1.65V to 2V power supply requirements and 200 MHz interface speeds.
Memory IC Selection Notes
Select this part when high-density code storage requires ultra-fast read performance in space-constrained designs. The Octal SPI interface significantly increases bandwidth compared to standard Quad SPI options. Verify that the PCB layout supports the TFBGA footprint and thermal dissipation needs for the specified operating temperature range.
Memory IC Part Context
This component belongs to the GD25LX series, which represents GigaDevice's high-performance octal SPI NOR flash portfolio. These devices are engineered to deliver industry-leading data throughput rates, addressing the growing demand for speed in modern embedded systems and automotive electronics.
Memory IC Replacement Considerations
Check for GD25LX256EBIRY or GD25LX256EFIRR if different packaging or temperature grades are acceptable. Verify pinout and electrical specifications before substituting any alternative part numbers.
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