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GD25LX256EBIRY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLSH 256MBIT SPI/OCTL 24TFBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25LX256EBIRY
- Description：IC FLSH 256MBIT SPI/OCTL 24TFBGA
- Series：-
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR
- Memory Size：256Mbit
- Memory Organization：32M x 8
- Memory Interface：SPI - Octal I/O
- Clock Frequency：200 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：1.65V ~ 2V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：24-TBGA
- Supplier Device Package：24-TFBGA (6x8)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25LX256EBIRY
Memory IC Overview
The GD25LX256EBIRY is a 256 Mbit NOR flash memory IC manufactured by GigaDevice. It features an SPI Octal I/O interface with a clock frequency of 200 MHz. The device has a memory organization of 32M x 8 and operates within a supply voltage range of 1.65 V to 2 V. It is housed in a 24-TFBGA (6x8) package and supports surface mount installation. The component functions within a temperature range of -40°C to 85°C.
Memory IC Feature Summary
- Supports high-speed data transfer via SPI Octal I/O interface
- Provides non-volatile storage for code and data retention
- Designed for surface mount applications in compact form factors
Memory IC Applications
- Portable consumer electronics requiring low power consumption
- Industrial control systems needing reliable code execution
- Automotive infotainment and connectivity modules
Memory IC Procurement Notes
Verify the specific suffix EBIRY against the manufacturer datasheet to confirm the 24-TFBGA package and Octal I/O configuration. Ensure supply voltage requirements align with system design, as the device operates between 1.65 V and 2 V. Confirm moisture sensitivity level and reflow soldering profiles prior to assembly.
Memory IC Selection Notes
Select this component when high throughput is required alongside low voltage operation. The Octal I/O capability distinguishes it from standard Quad SPI variants. Verify that the PCB layout accommodates the 24-TFBGA footprint and that thermal management meets the specified operating temperature range for the intended environment.
Memory IC Part Context
This part belongs to the GD25LX series, which focuses on high-performance Octal SPI NOR flash memories. The series is designed to meet the demands of modern embedded systems requiring fast boot times and efficient data access. It complements other GD25 variants offering different interface speeds and package options.
Memory IC Replacement Considerations
Check for GD25LX256EBJRR or GD25LX256EB2RY if different packaging or extended temperature ranges are needed. Verify pin compatibility and electrical specifications before substituting with other GD25LX family members.
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