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GD25LX256EBJRY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25LX256EBJRY
- Description：IC FLASH
- Series：-
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tray
- Memory Type：-
- Memory Format：FLASH
- Technology：FLASH - NOR
- Memory Size：-
- Memory Organization：-
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25LX256EBJRY
Memory IC Overview
The GD25LX256EBJRY is a 256 Mbit NOR flash memory IC manufactured by GigaDevice. It features an Octal I/O SPI interface with a maximum clock frequency of 200 MHz and supports DTR mode. The device operates within a supply voltage range of 1.65 V to 2 V and utilizes a 24-TFBGA (6x8) package. Memory organization is specified as 32M x 8 bits. It functions as non-volatile storage with surface mount installation.
Memory IC Feature Summary
- Supports high-speed Octal I/O SPI interface with DTR capability for enhanced data throughput
- Provides reliable non-volatile code storage using SLC NAND technology architecture
- Operates within extended industrial temperature ranges suitable for diverse environments
Memory IC Applications
- Embedded systems requiring high-performance code execution
- Industrial control equipment needing robust data retention
- Consumer electronics utilizing compact surface-mount designs
Memory IC Procurement Notes
Verify the specific suffix JRR against official datasheets to confirm packaging type, as distributor listings may vary between tray and reel formats. Ensure compatibility with 1.65V to 2V power domains. Confirm moisture sensitivity level requirements during assembly. Cross-reference RoHS compliance status with current manufacturer declarations before finalizing procurement orders.
Memory IC Selection Notes
Select this component when Octal SPI performance is required alongside low voltage operation. Compare against GD25LB series for different interface options or temperature grades. Verify pinout compatibility with existing PCB layouts due to the TFBGA footprint. Consider thermal management requirements associated with the small form factor package during system design.
Memory IC Part Context
This part belongs to the GD25LX family of high-performance Octal SPI NOR flash memories. The series targets applications demanding faster read speeds compared to standard Quad SPI devices. It complements other GigaDevice memory solutions offering varying densities and interface capabilities for scalable embedded storage architectures.
Memory IC Replacement Considerations
GD25LX256EBIRY offers identical electrical specifications but differs in the trailing packaging suffix, indicating potential variations in tape-and-reel versus tray configuration. Verify mechanical dimensions remain consistent before substitution.
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