GD25Q127CBIGY

Memory IC Overview

The GD25Q127CBIGY is a 128 Mbit NOR Flash memory device manufactured by GigaDevice. It features an SPI interface with a maximum clock frequency of 104 MHz and operates within a voltage range of 2.7 V to 3.6 V. The active read current is specified at a maximum of 27 mA. The memory organization is 16 M x 8 bits. It supports surface mount installation in a TFBGA-24 package (5x5 mm ball array). The component is rated for industrial operating temperatures from -40°C to +85°C and includes humidity sensitivity classification.

Memory IC Feature Summary

• Supports standard SPI, Dual I/O, Quad I/O, and QPI modes for flexible data transfer
• Includes hardware reset functionality and security registers with OTP locks
• Features unique ID capability and suspend mode for power management

Memory IC Applications

• Industrial embedded systems requiring code storage
• Consumer electronics firmware applications
• IoT devices needing reliable non-volatile memory

Memory IC Procurement Notes

Verify the NRND status before integration, as this indicates the component is not recommended for new designs. Confirm lead times and minimum order quantities directly with authorized distributors, as availability may be restricted. Ensure compliance with RoHS directives and moisture sensitivity level requirements during handling and assembly processes.

Memory IC Selection Notes

Select this part when a 128 Mbit density is required in a compact TFBGA-24 footprint. It is suitable for designs needing industrial temperature stability and SPI compatibility. Consider alternative packages like WSON if board space constraints differ. Verify that the 104 MHz speed meets system timing requirements compared to higher-speed variants in the same family.

Memory IC Part Context

This component belongs to the GD25Q127C series of SPI NOR Flash memories. It shares architectural similarities with other members like the GD25Q32CBIGY but offers higher storage capacity. The series targets diverse market segments including consumer and industrial electronics, providing scalability across different density options while maintaining consistent interface protocols.

Memory IC Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Due to the NRND status, direct replacements should be evaluated based on pin compatibility and electrical specifications. Consult manufacturer guidelines for end-of-life transition strategies.