Memory IC GD25Q128EWIGR product image

GD25Q128EWIGR

$1.57
  • Description:IC FLASH 128MBIT SPI/QUAD 8WSON
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:a2ccf1a93c8e Category: Brand:

  
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GD25Q128EWIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 128MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25Q128EWIGR

  • Description:IC FLASH 128MBIT SPI/QUAD 8WSON
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:128Mbit
  • Memory Organization:16M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:70µs, 2.4ms
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-WDFN Exposed Pad
  • Supplier Device Package:8-WSON (5x6)
  • Access Time:7 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25Q128EWIGR

GD25Q128EWIGR

Memory IC Overview

The GD25Q128EWIGR is a 128 Mbit NOR flash memory IC manufactured by GigaDevice. It features an SPI interface with Quad I/O support and operates at a maximum clock frequency of 133 MHz. The device has a storage organization of 16 M x 8 bits and supports a supply voltage range from 2.7 V to 3.6 V. Active read current is specified at a maximum of 25 mA. It is housed in an 8-WSON package (5x6 mm) and is designed for surface mount installation. The component functions within a temperature range of -40°C to +85°C.

Memory IC Feature Summary

  • Supports high-speed serial peripheral interface communication with quad input/output capabilities for efficient data transfer.
  • Provides non-volatile storage architecture suitable for code execution and data retention applications.
  • Operates reliably across extended industrial temperature ranges for diverse environmental conditions.

Memory IC Applications

  • Embedded systems requiring direct code execution from flash memory
  • Industrial control units needing reliable non-volatile storage
  • Consumer electronics utilizing compact surface-mount memory solutions

Memory IC Procurement Notes

Verify the specific suffix 'WIGR' corresponds to the WSON-8 package variant when sourcing. Confirm RoHS compliance status and moisture sensitivity level requirements against project specifications. Ensure the supplier provides official datasheets matching the manufacturer's documentation for accurate electrical parameter validation.

Memory IC Selection Notes

Select this component when a 128 Mbit capacity is required with a compact WSON footprint. Compare against the GD25Q128ESIGR if an SOIC package is preferred instead of WSON. Consider the GD25LQ128EWIGR if lower voltage operation below 2.7 V is necessary for the target application design.

Memory IC Part Context

This part belongs to the GD25Q128E series of NOR flash memories. It shares core functional specifications with other variants like the GD25Q128ESIGR, differing primarily in physical packaging. The series is designed for general-purpose embedded storage needs.

Memory IC Replacement Considerations

GD25Q128ESIGR serves as a manufacturer-recommended alternative with identical electrical characteristics but utilizes an 8-SOP package instead of WSON. Verify pin compatibility and thermal performance differences before substitution.

GD25Q128EWIGRGD25Q128EWIGR
$1.57
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