Memory IC GD25Q16CNIGR product image

GD25Q16CNIGR

  • Description:IC FLASH 16MBIT SPI/QUAD 8USON
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:151a0a079591 Category: Brand:

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GD25Q16CNIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 16MBIT SPI/QUAD 8USON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25Q16CNIGR

  • Description:IC FLASH 16MBIT SPI/QUAD 8USON
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:16Mbit
  • Memory Organization:2M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:120 MHz
  • Write Cycle Time - Word, Page:50µs, 2.4ms
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-UDFN Exposed Pad
  • Supplier Device Package:8-USON (4x3)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25Q16CNIGR

GD25Q16CNIGR

Memory IC Overview

The GD25Q16CNIGR is a 16M-bit (2M x 8) NOR flash memory manufactured by GigaDevice. It operates on a single 3.3V power supply within a voltage range of 2.7V to 3.6V. The device supports standard, dual, and quad SPI interfaces with a maximum clock frequency of 120 MHz. It features uniform sector architecture with 4K-byte sectors and 32/64K-byte blocks. Packaged in an 8-USON (3x4mm) format, it functions within an industrial temperature range of -40°C to +85°C.

Memory IC Feature Summary

  • Supports Dual and Quad Serial Peripheral Interface for high-speed data transfer up to 480 Mbits/s.
  • Features flexible software and hardware write protection mechanisms including block protect bits and WP# pin control.
  • Includes advanced security capabilities such as a 128-bit unique ID and four 256-byte security registers with OTP locks.
  • Provides Execute In Place (XIP) operation capability for direct code execution from the memory.

Memory IC Applications

  • Firmware storage for embedded systems
  • Code execution applications requiring XIP support
  • Industrial control systems operating in extended temperature ranges
  • Consumer electronics requiring reliable non-volatile data retention

Memory IC Procurement Notes

Verify component authenticity through official manufacturer channels or authorized distributors. Confirm that the specific ordering suffix matches the required package type and temperature grade. Check for current lifecycle status notifications as this part may be subject to production changes. Ensure compliance with RoHS directives relevant to your region before integration into final products.

Memory IC Selection Notes

Select this component when a 16M-bit density is required with uniform sector erase capabilities. It is suitable for designs needing high read speeds via Quad SPI interface. Consider the USON-8 package constraints for PCB layout. Verify that the system voltage aligns with the 2.7V to 3.6V operating range. Evaluate thermal requirements against the specified industrial temperature limits.

Memory IC Part Context

This device belongs to the GD25Q16C series of 3.3V Uniform Sector Dual and Quad Serial Flash memories. It shares architectural similarities with other members of the GD25Q family but offers specific capacity and package variations. The series is designed for general-purpose non-volatile storage needs across various electronic applications.

Memory IC Replacement Considerations

GD25Q16CWIGR: Identical electrical specifications and functionality, differing only in the WSON-8 package form factor compared to the USON-8 package of the primary model.

GD25Q16CNIGRGD25Q16CNIGR

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