Memory IC GD25Q256DBIGY product image

GD25Q256DBIGY

$2.33
  • Description:IC FLSH 256MBIT SPI/QUAD 24TFBGA
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray

SKU:12db01d4bd0c Category: Brand:

  
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GD25Q256DBIGY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLSH 256MBIT SPI/QUAD 24TFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25Q256DBIGY

  • Description:IC FLSH 256MBIT SPI/QUAD 24TFBGA
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:256Mbit
  • Memory Organization:32M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:104 MHz
  • Write Cycle Time - Word, Page:50µs, 2.4ms
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:24-TBGA
  • Supplier Device Package:24-TFBGA (6x8)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25Q256DBIGY

GD25Q256DBIGY

Memory IC Overview

The GD25Q256DBIGY is a 256 Mbit NOR flash memory device manufactured by GigaDevice. It features a 32M x 8 organization and supports SPI and Quad I/O interfaces with a maximum clock frequency of 104 MHz. The component operates within a voltage range of 2.7 V to 3.6 V and has a maximum active read current of 25 mA. It is housed in a 24-TFBGA (6x8) package and is rated for an industrial temperature range of -40°C to +85°C.

Memory IC Feature Summary

  • Supports standard SPI and Quad I/O data transfer modes for flexible interface compatibility.
  • Provides uniform sector architecture suitable for code storage applications requiring consistent erase sizes.
  • Includes hardware write protection and absolute write protection mechanisms to ensure data integrity.

Memory IC Applications

  • Industrial control systems requiring reliable non-volatile code execution
  • Consumer electronics utilizing surface-mount technology constraints
  • Embedded systems needing uniform sector flash for firmware storage

Memory IC Procurement Notes

Verify the current lifecycle status, as sources indicate this part may be marked as Not Recommended for New Designs (NRND). Confirm availability through authorized distributors, noting that supply chain constraints may affect delivery times. Ensure compliance with RoHS3 specifications and moisture sensitivity level requirements during handling and assembly processes.

Memory IC Selection Notes

Select this component when a 256 Mbit capacity with TFBGA-24 packaging is required for industrial environments. Compare against the GD25Q256DYIGR if WSON-8 packaging or tape-and-reel delivery is preferred. Consider the GD25Q256EWIGY if higher clock speeds up to 133 MHz are necessary for system performance optimization.

Memory IC Part Context

This part belongs to the GD25Q256D series of serial flash memories from GigaDevice. It shares core electrical characteristics with other variants in the family but differs primarily in its physical package type. The TFBGA-24 form factor distinguishes it from SOP or WSON alternatives within the same product line.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers include GD25Q256DYIGR and GD25Q256EWIGY. Verify pinout compatibility and package dimensions before substitution, as these variants utilize different footprints such as WSON-8.

GD25Q256DBIGYGD25Q256DBIGY
$2.33
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