GD25Q256DFIGR

Memory IC Overview

The GD25Q256DFIGR is a 256 Mbit NOR flash memory device manufactured by GigaDevice. It features an SPI interface with support for dual and quad I/O operations, operating at a maximum clock frequency of 104 MHz. The device has a storage organization of 32 M x 8 bits and requires a supply voltage between 2.7 V and 3.6 V. It is housed in a 16-SOP package with a width of 7.50 mm. The component supports industrial temperature ranges from -40°C to +85°C and includes humidity sensitivity classification. Active read current is specified at a maximum of 25 mA.

Memory IC Feature Summary

• Supports uniform sector architecture for flexible data protection
• Enables high-speed serial communication via standard SPI protocol
• Provides hardware write protection mechanisms for critical code segments

Memory IC Applications

• Code storage for microcontrollers and system-on-chip designs
• XIP (Execute-In-Place) applications requiring direct code execution
• Industrial control systems operating within extended temperature ranges

Memory IC Procurement Notes

Verify the specific suffix 'GR' indicates tape and reel packaging configuration. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Check for moisture sensitivity level requirements during surface mount assembly processes. Ensure design compatibility with the 16-SOP footprint dimensions. Validate that the industrial temperature range meets the operational environment specifications.

Memory IC Selection Notes

Select this component when 256 Mbit capacity is required in a 16-pin SOP package. Consider the 104 MHz speed limit for timing-critical interfaces. Evaluate power consumption constraints against the 25 mA active read specification. Compare physical dimensions against available board space. Verify that the 2.7 V to 3.6 V voltage range aligns with the system power rails.

Memory IC Part Context

This part belongs to the GD25Q256D series of SPI NOR flash memories. It shares core electrical characteristics with other variants in the family but differs in package type and shipping format. The series targets general-purpose embedded storage needs. Other members may offer different pin counts or thermal ratings.

Memory IC Replacement Considerations

GD25Q256DYIGR offers identical electrical performance in a WSON-8 package. GD25Q257DFIGR provides ECC capabilities within the same SOP-16 form factor. Verify pinout compatibility before substituting packages. Review datasheet differences for any functional variations.