Memory IC GD25Q256EYIGR product image

GD25Q256EYIGR

$2.85
  • Description:IC FLASH 256MBIT SPI/QUAD 8WSON
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:2a14a31995df Category: Brand:

  
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GD25Q256EYIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 256MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25Q256EYIGR

  • Description:IC FLASH 256MBIT SPI/QUAD 8WSON
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:256Mbit
  • Memory Organization:32M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:50µs, 2.4ms
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-WDFN Exposed Pad
  • Supplier Device Package:8-WSON (6x8)
  • Access Time:7 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25Q256EYIGR

GD25Q256EYIGR

Memory IC Overview

The GD25Q256EYIGR is a 256Mbit (32M x 8) SPI NOR Flash memory manufactured by GigaDevice. It operates within a voltage range of 2.7V to 3.6V and supports standard, dual, and quad SPI interfaces with a maximum clock frequency of 133MHz. The device features a WSON-8 package (6x8mm) with an exposed pad. Key electrical parameters include a standby current of 16uA, a page write time of 250us, and a 64KB block erase time of 150ms. It ensures data retention for 20 years and withstands 100,000 erase/write cycles. The operational temperature range spans from -40°C to +85°C.

Memory IC Feature Summary

  • Supports standard, dual, and quad SPI protocols for flexible data transfer speeds.
  • Includes hardware write protection, absolute write protection, and software write protection mechanisms.
  • Features write enable latch and power-on reset functionality for reliable operation.
  • Provides high endurance with 100,000 erase/write cycles and long-term data retention.

Memory IC Applications

  • Consumer electronics firmware storage
  • Industrial control system code execution
  • Networking equipment boot code storage

Memory IC Procurement Notes

Verify the specific suffix 'YIGR' against official datasheets to confirm the package type and tape-and-reel specifications. Ensure compatibility with the target system's voltage levels and interface requirements. Confirm RoHS compliance status if required by regulatory standards. Check for any recent product change notifications that may affect pinout or electrical characteristics before finalizing procurement.

Memory IC Selection Notes

Select this component when a 256Mbit capacity is required with support for high-speed quad SPI operations up to 133MHz. It is suitable for applications needing robust write protection features and industrial temperature range operation. Consider the WSON-8 footprint constraints during PCB layout. Compare performance metrics like page write time and block erase time against alternative parts if speed is critical.

Memory IC Part Context

This part belongs to the GD25Q series of SPI NOR Flash memories from GigaDevice. The series is designed for general-purpose non-volatile storage in embedded systems. The 'E' variant typically denotes specific performance enhancements over previous generations. The 'GD25Q256' base model indicates the 256Mbit density class within the broader portfolio.

Memory IC Replacement Considerations

GD25B256EWIGR is listed as a parameter-equivalent substitute. Verify functional equivalence regarding interface modes and protection features before substitution.

GD25Q256EYIGRGD25Q256EYIGR
$2.85
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