GD25Q64EBIGY

Memory IC Overview

The GD25Q64EBIGY is a 64 Mbit SPI NOR Flash memory manufactured by GigaDevice. It utilizes a TFBGA-24 package with a 4x6 ball array configuration. The device supports standard, Dual, and Quad SPI interfaces with a maximum clock frequency of 133 MHz. Operating voltage ranges from 2.7 V to 3.6 V. It features uniform sector architecture with 4 KByte sectors and 32/64 KByte blocks. Data retention is rated for 20 years, with endurance supporting at least 100,000 program/erase cycles.

Memory IC Feature Summary

• Supports Standard, Dual, and Quad SPI modes for flexible data transfer rates
• Includes hardware and software write protection mechanisms via WP# pin and status register bits
• Features a unique 128-bit ID and security registers with OTP lock capabilities
• Enables Execute In Place (XiP) operation for direct code execution

Memory IC Applications

• Storing firmware and bootloaders in embedded systems
• Data storage for IoT devices and consumer electronics
• Configuration parameter storage in industrial control applications
• Code execution in place (XiP) for microcontroller systems

Memory IC Procurement Notes

Verify the specific suffix 'IGY' corresponds to the TFBGA-24 package and tray packaging format as listed in official ordering information. Confirm that the component meets required environmental specifications for the intended operating temperature range. Ensure compatibility with existing PCB footprint designs utilizing the 4x6 ball array layout before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a compact surface-mount solution is required for 64 Mbit storage capacity. The TFBGA-24 package offers a small form factor suitable for space-constrained designs. Ensure the host system supports the necessary SPI command set and voltage levels between 2.7 V and 3.6 V for proper operation.

Memory IC Part Context

This part belongs to the GD25Q64E series of Uniform Sector Dual and Quad Serial Flash memories. The series provides high-speed read capabilities and flexible architecture options. Other variants in the family include different package types such as SOP8, USON8, and WSON8, catering to various board space and manufacturing requirements while maintaining consistent electrical performance.

Memory IC Replacement Considerations

GD25B64ESIGR is listed as a parameter equivalent substitute.