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GD25Q64EFIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 64MBIT SPI/QUAD 16SOP. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25Q64EFIGR
- Description：IC FLASH 64MBIT SPI/QUAD 16SOP
- Series：GD25Q
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：64Mbit
- Memory Organization：8M x 8
- Memory Interface：SPI - Quad I/O
- Clock Frequency：133 MHz
- Write Cycle Time - Word, Page：70µs, 2.4ms
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：16-SOIC (0.295", 7.50mm Width)
- Supplier Device Package：16-SOP
- Access Time：7 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25Q64EFIGR
Memory IC Overview
The GD25Q64EFIGR is a 64 Mbit NOR flash memory device manufactured by GigaDevice. It features a 16-lead SOP package (SOP16) and supports standard, dual, and quad SPI interfaces with a maximum clock frequency of 133 MHz. The device operates within a voltage range of 2.7 V to 3.6 V and functions across an industrial temperature range of -40°C to +85°C. It utilizes a uniform sector architecture with 256-byte pages for programming.
Memory IC Feature Summary
- Supports standard, dual, and quad serial peripheral interface modes for flexible data transfer rates
- Provides software and hardware write protection mechanisms including block protect bits and WP# pin control
- Features advanced security capabilities such as unique identification registers and programmable security registers
- Enables execute-in-place operation through high-speed continuous read commands
Memory IC Applications
- Storage of firmware and boot code in embedded systems
- Configuration parameter storage in consumer electronics
- Data logging applications requiring reliable non-volatile memory
- Industrial control systems operating in wide temperature ranges
Memory IC Procurement Notes
Verify the specific suffix FIGR corresponds to the 16-lead SOP package and tape-and-reel packaging configuration. Confirm that the component meets RoHS compliance requirements for your target market. Ensure compatibility with existing PCB footprints designed for the 16-SOP form factor before finalizing procurement orders.
Memory IC Selection Notes
Select this component when a 16-pin surface mount package is required for space-constrained designs. Choose this part if the application demands support for both dual and quad SPI modes alongside standard SPI operations. Consider this device for projects requiring robust write protection features and industrial-grade temperature stability.
Memory IC Part Context
This component belongs to the GD25Q64E series of uniform sector serial flash memories. It shares architectural similarities with other members of the family but differs in package type and manufacturing revision. The device integrates high-voltage generators and write protect logic directly onto the silicon die to manage program and erase operations efficiently.
Memory IC Replacement Considerations
GD25Q64CFIGR
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