Memory IC GD25Q64ENIGR product image

GD25Q64ENIGR

$0.71
  • Description:IC FLASH 64MBIT SPI/QUAD 8USON
  • Series:GD25Q
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:55610435fa3a Category: Brand:

  
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GD25Q64ENIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 64MBIT SPI/QUAD 8USON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25Q64ENIGR

  • Description:IC FLASH 64MBIT SPI/QUAD 8USON
  • Series:GD25Q
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:64Mbit
  • Memory Organization:8M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:70µs, 2.4ms
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-UDFN Exposed Pad
  • Supplier Device Package:8-USON (3x4)
  • Access Time:7 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25Q64ENIGR

GD25Q64ENIGR

Memory IC Overview

The GD25Q64ENIGR is a 64M-bit (8M x 8) SPI NOR Flash memory manufactured by GigaDevice. It supports standard, Dual, and Quad SPI interfaces with a maximum clock frequency of 133MHz. The device operates on a single power supply voltage ranging from 2.7V to 3.6V. It features uniform sector architecture with 4K-byte sectors and 32/64K-byte blocks. Key electrical characteristics include a typical standby current of 12μA and deep power-down current of 1μA. The component offers a minimum endurance of 100,000 program/erase cycles and a typical data retention of 20 years.

Memory IC Feature Summary

  • Supports Standard, Dual, and Quad SPI modes for flexible data transfer rates up to 532Mbits/s in Quad I/O mode.
  • Provides comprehensive software and hardware write protection mechanisms including top/bottom block protection via WP# pin.
  • Includes advanced security features such as a 128-bit unique ID per device and Serial Flash Discoverable Parameters (SFDP).
  • Enables Execute In Place (XiP) operation with high-speed read commands to reduce instruction fetch latency.

Memory IC Applications

  • Storing firmware, bootloaders, and operating system kernels in embedded systems.
  • Hosting BIOS code for PC motherboards and industrial control units.
  • Data storage for IoT devices, consumer electronics, and communication modules.
  • System configuration parameter and log data retention.

Memory IC Procurement Notes

Verify the specific package suffix 'NI' against the manufacturer's official ordering guide to confirm the exact physical dimensions and lead frame material. Ensure compatibility with the target PCB footprint for the USON8 package type. Confirm that the required dummy cycle settings align with the host controller's SPI interface capabilities at 133MHz.

Memory IC Selection Notes

Select this component when a 64M-bit capacity is required with support for Quad SPI operations. Consider the USON8 package if space-constrained surface-mount applications are prioritized over larger SOP packages. Verify that the host system can support the necessary status register configurations for Quad Enable (QE) bit activation.

Memory IC Part Context

This part belongs to the GD25Q64E series of uniform sector dual and quad serial flash memories. The series is designed for high-performance applications requiring fast read speeds and robust data protection. It shares architectural similarities with other members of the GD25Q family but differs in specific package options and minor electrical tolerances defined by the manufacturer.

Memory IC Replacement Considerations

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