Memory IC GD25Q64ETIGR product image

GD25Q64ETIGR

$0.92
  • Description:IC FLASH 64MBIT SPI/QUAD 8SOP
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:2392b0df79d7 Category: Brand:

  
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GD25Q64ETIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 64MBIT SPI/QUAD 8SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25Q64ETIGR

  • Description:IC FLASH 64MBIT SPI/QUAD 8SOP
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:64Mbit
  • Memory Organization:8M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:70µs, 2.4ms
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package:8-SOP
  • Access Time:7 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25Q64ETIGR

GD25Q64ETIGR

Memory IC Overview

The GD25Q64ETIGR is a 64M-bit (8M x 8) SPI NOR Flash memory manufactured by GigaDevice. It supports standard, Dual, and Quad SPI interfaces with a maximum clock frequency of 133 MHz. The device operates on a single power supply ranging from 2.7V to 3.6V. It features uniform sector architecture with 4K-byte sectors and 32/64K-byte blocks. Key electrical parameters include a typical standby current of 12μA and deep power-down current of 1μA. Endurance is rated for a minimum of 100,000 program/erase cycles with 20-year data retention.

Memory IC Feature Summary

  • Supports Standard, Dual, and Quad SPI modes for flexible data transfer rates up to 532 Mbits/s in Quad I/O mode.
  • Provides comprehensive software and hardware write protection mechanisms including block protect bits and WP# pin control.
  • Features advanced security capabilities such as a 128-bit unique ID, SFDP support, and three 3KB security registers with OTP locks.
  • Enables Execute In Place (XiP) operation with continuous read wrap functionality to reduce instruction fetch latency.

Memory IC Applications

  • Storing firmware, bootloaders, and operating system kernels in embedded systems.
  • Hosting BIOS code and configuration data for consumer electronics and industrial controllers.
  • Serving as non-volatile storage for IoT devices, routers, and communication modules requiring fast random access.

Memory IC Procurement Notes

Verify the specific package variant corresponding to the suffix 'GR' against the manufacturer's ordering guide, as it denotes tape and reel packaging. Confirm that the design accommodates the required voltage levels and signal integrity for 133 MHz operation. Ensure compatibility with the host controller's SPI interface modes, particularly if utilizing Quad I/O commands which require the Quad Enable bit to be set.

Memory IC Selection Notes

Select this component when a high-density 64M-bit capacity is required alongside fast read speeds and robust data protection features. It is suitable for designs needing uniform sector erase sizes for consistent wear leveling or secure storage applications. Consider the SOP-8 package constraints regarding PCB space and thermal management. Verify that the application environment falls within the specified commercial temperature range.

Memory IC Part Context

This part belongs to the GD25Q64E series of uniform sector dual and quad serial flash memories. The series is designed for general-purpose non-volatile storage applications requiring high reliability and flexibility. The GD25Q64ETIGR specifically utilizes the SOP-8 package format with tape and reel delivery, distinguishing it from tray-packaged or alternative package variants within the same memory density family.

Memory IC Replacement Considerations

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