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GD25R128EYIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 128MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25R128EYIGR
- Description：IC FLASH 128MBIT SPI/QUAD 8WSON
- Series：GD25R
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：128Mbit
- Memory Organization：16M x 8
- Memory Interface：SPI - Quad I/O
- Clock Frequency：200 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-WDFN Exposed Pad
- Supplier Device Package：8-WSON (6x8)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25R128EYIGR
Memory IC Overview
The GD25R128EYIGR is a 128 Mbit SPI NOR Flash memory IC manufactured by GigaDevice. It features Quad I/O support for enhanced data throughput. The device operates within a supply voltage range of 2.7 V to 3.6 V and supports surface mount installation in an 8-WSON package. It is designed for reliable code storage with an operating temperature range of -40°C to +85°C.
Memory IC Feature Summary
- Supports SPI interface with Quad I/O capability for high-speed data transfer
- Provides 128 Mbit density suitable for embedded code storage applications
- Operates reliably across industrial temperature ranges
Memory IC Applications
- Embedded systems requiring non-volatile code storage
- Industrial control devices
- Consumer electronics firmware storage
Memory IC Procurement Notes
Verify the exact datasheet specifications for the GD25R128EYIGR before integration, as public listings may vary in detail. Confirm package type and voltage requirements match your design constraints. Ensure compatibility with your system's SPI controller settings for Quad I/O operation. Check for any specific automotive or industrial certifications if required for your application environment.
Memory IC Selection Notes
Select this component when a 128 Mbit capacity with Quad I/O support is needed. It is suitable for designs requiring 2.7V to 3.6V operation. Consider the 8-WSON package for space-constrained PCB layouts. Verify that the target application falls within the specified -40°C to +85°C temperature range for optimal performance.
Memory IC Part Context
This part belongs to the GigaDevice GD25 series of SPI NOR Flash memories. The series offers various densities and interfaces to meet diverse storage needs. GigaDevice provides these components for consumer, industrial, and automotive markets, focusing on reliability and performance. The GD25R128EYIGR specifically targets applications needing moderate density with improved read speeds via Quad I/O.
Memory IC Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided source material. Consult official GigaDevice documentation or authorized distributors for qualified alternatives.
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