Memory IC GD25R256EYIGR product image

GD25R256EYIGR

$2.29
  • Description:IC FLASH 256MBIT SPI/QUAD 8WSON
  • Series:GD25R
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:26e4c281ff99 Category: Brand:

  
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GD25R256EYIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 256MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25R256EYIGR

  • Description:IC FLASH 256MBIT SPI/QUAD 8WSON
  • Series:GD25R
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:256Mbit
  • Memory Organization:32M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-WDFN Exposed Pad
  • Supplier Device Package:8-WSON (6x8)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25R256EYIGR

GD25R256EYIGR

Memory IC Overview

The GD25R256EYIGR is a 256 Mbit SPI NOR Flash memory IC manufactured by GigaDevice. It features a 32M x 8 memory organization and supports Single I/O, Quad I/O, QPI, and DTR interfaces. The device operates with a supply voltage range of 2.7V to 3.6V and achieves clock frequencies up to 104 MHz in standard modes, or 60 MHz in Quad DTR mode. It functions within an operating temperature range of -40°C to +85°C.

Memory IC Feature Summary

  • Supports Dual, Quad, and QPI serial interface protocols for flexible system integration
  • Includes hardware reset functionality and write-protect capabilities
  • Features security registers with OTP locks for data protection
  • Provides unique identification for device tracking

Memory IC Applications

  • Storing firmware and boot code in embedded systems
  • Configuration data storage for IoT devices
  • Application file storage in mobile solutions
  • Code execution in XIP (Execute-In-Place) applications

Memory IC Procurement Notes

Verify the specific suffix 'YIGR' against the manufacturer's official datasheet to confirm package type and tape/reel specifications. Ensure the design accommodates the 2.7V to 3.6V supply voltage range. Confirm that the required interface modes (Single/Quad/QPI/DTR) are supported by the host controller. Check for any automotive-grade variants if higher reliability standards are needed.

Memory IC Selection Notes

Select this component when a 256 Mbit capacity is required with support for high-speed DTR operations. It is suitable for designs needing hardware reset and write-protect features. Compare with the GD25Q series if only standard Quad I/O is sufficient, or the GD25L series if lower voltage operation is necessary. Ensure the WSON-8 package fits the PCB layout constraints.

Memory IC Part Context

This part belongs to the GD25 SPI NOR Flash family from GigaDevice, which offers densities from 512Kb to 2Gb. The series targets consumer electronics, industrial controls, and automotive applications. Products in this family are designed for high performance, low power consumption, and small packages, with some variants achieving AEC-Q100 qualification.

Memory IC Replacement Considerations

GD25Q256EYIGR: Similar capacity and package but lacks DTR support and operates at 2.7V-3.6V. GD25LR256E: Lower voltage variant (1.65V-2.0V) with similar features but different electrical characteristics.

GD25R256EYIGRGD25R256EYIGR
$2.29
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