Memory IC GD25R512MEYIGR product image

GD25R512MEYIGR

$3.91
  • Description:IC FLASH 512MBIT SPI/QUAD 8WSON
  • Series:GD25R
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:7c3a069c715b Category: Brand:

  
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GD25R512MEYIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 512MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25R512MEYIGR

  • Description:IC FLASH 512MBIT SPI/QUAD 8WSON
  • Series:GD25R
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:512Mbit
  • Memory Organization:64M x 8
  • Memory Interface:SPI - Quad I/O, DTR
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-WDFN Exposed Pad
  • Supplier Device Package:8-WSON (6x8)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25R512MEYIGR

GD25R512MEYIGR

Memory IC Overview

The GD25R512MEYIGR is a 512 Mbit NOR flash memory device manufactured by GigaDevice. It utilizes an SPI interface with support for Dual, Quad SPI, QPI, and standard SPI modes. The component operates within a voltage range of 2.7 V to 3.6 V and supports a maximum clock frequency of 104 MHz. Designed for surface mount installation, it is housed in a Reel package format. The device functions reliably across an industrial temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Supports multiple interface modes including Dual/Quad SPI, QPI, and standard SPI for flexible system integration.
  • Features synchronous timing type for consistent data transfer operations.
  • Provides non-volatile storage suitable for code execution and data retention.

Memory IC Applications

  • Embedded systems requiring reliable code storage
  • Industrial control applications
  • Consumer electronics devices

Memory IC Procurement Notes

Verify the specific interface mode requirements against the target system controller before procurement. Confirm that the operating voltage range aligns with the design specifications. Ensure the reel packaging format matches the automated assembly equipment capabilities. Check for any regional sales restrictions or shipping limitations associated with this part number.

Memory IC Selection Notes

Select this component when a 512 Mbit density is required with support for high-speed Quad and QPI interfaces. It is appropriate for designs needing industrial temperature stability and a 3V supply rail. Consider alternative packages if footprint constraints differ from the available options.

Memory IC Part Context

This part belongs to the GD25 series of SPI NOR flash memories from GigaDevice. The series targets diverse market segments with densities ranging from 512Kb to 2Gb. These products are designed to deliver performance and reliability for embedded applications, supporting various power supply types and package options to meet different design requirements.

Memory IC Replacement Considerations

GD25S512MDFIGR offers similar capacity but uses SOP-16 packaging and has a lower maximum clock frequency of 104 MHz. GD25B512MEYIGR provides comparable specifications with WSON-8 packaging. Verify pin compatibility and interface support when substituting.

GD25R512MEYIGRGD25R512MEYIGR
$3.91
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