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GD25R512MFYIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25R512MFYIGR
- Description：IC FLASH
- Series：-
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：-
- Memory Format：FLASH
- Technology：FLASH - NOR
- Memory Size：-
- Memory Organization：-
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25R512MFYIGR
Memory IC Overview
The GD25R512MFYIGR is a 512 Mbit NOR flash memory IC manufactured by GigaDevice. It operates within a supply voltage range of 2.7 V to 3.6 V and supports Dual/Quad SPI, QPI, and standard SPI interfaces. The device achieves a maximum clock frequency of 104 MHz with synchronous timing. Designed for surface-mount installation, it functions reliably across an operating temperature range of -40°C to +85°C.
Memory IC Feature Summary
- Supports multiple interface modes including Dual/Quad SPI, QPI, and standard SPI for flexible system integration.
- Provides high-speed data access capabilities through a maximum clock frequency of 104 MHz.
- Ensures operational stability in demanding environments with a wide industrial temperature rating.
Memory IC Applications
- Consumer electronics firmware storage
- Industrial control system code execution
- IoT device application hosting
Memory IC Procurement Notes
Verify the specific suffix 'IGR' against official datasheets to confirm tape-and-reel packaging and lead-free status. Confirm RoHS compliance details directly from manufacturer documentation before procurement. Ensure the selected variant matches the required voltage and interface specifications for the target design.
Memory IC Selection Notes
Select this component when a 512 Mbit density is required with support for Quad SPI or QPI modes. It is suitable for designs needing a 3V supply rail and operation up to 104 MHz. Consider the WSON-8 package dimensions and industrial temperature range during PCB layout and thermal management planning.
Memory IC Part Context
This part belongs to the GD25R series of SPI NOR flash memories from GigaDevice. The series targets applications requiring moderate density with enhanced interface flexibility. It complements other variants in the portfolio that may offer different densities or package options while maintaining similar core performance characteristics.
Memory IC Replacement Considerations
Check for pin-compatible alternatives within the same density class if supply constraints exist. Verify that any substitute supports the same Quad SPI/QPI interface requirements and voltage ranges to ensure functional equivalence without circuit redesign.
Memory IC FAQ
What interface modes does the GD25R512MFYIGR support?
It supports Standard SPI, Dual SPI, Quad SPI, and Quad Page Program (QPI) modes.
Is the GD25R512MFYIGR suitable for automotive applications?
Standard commercial versions are not explicitly AEC-Q100 qualified; verify specific automotive-grade variants like the GD25L series for such requirements.
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