Memory IC GD25S512MDBIGY product image

GD25S512MDBIGY

  • Description:IC FLSH 512MBIT SPI/QUAD 24TFBGA
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray

SKU:1275be4b53e7 Category: Brand:

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GD25S512MDBIGY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLSH 512MBIT SPI/QUAD 24TFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25S512MDBIGY

  • Description:IC FLSH 512MBIT SPI/QUAD 24TFBGA
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:512Mbit
  • Memory Organization:64M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:104 MHz
  • Write Cycle Time - Word, Page:50µs, 2.4ms
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:24-TBGA
  • Supplier Device Package:24-TFBGA (6x8)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25S512MDBIGY

GD25S512MDBIGY

Memory IC Overview

The GD25S512MDBIGY is a 512 Mbit NOR flash memory device manufactured by GigaDevice. It features an SPI interface with a maximum clock frequency of 104 MHz and supports Quad I/O modes. The storage organization is 64 M x 8 bits, with an active read current maximum of 25 mA. Operating voltage ranges from 2.7 V to 3.6 V. The component is housed in a TFBGA-24 package (5x5 mm ball array) and is rated for industrial temperatures between -40°C and +85°C. It is classified as Not Recommended for New Designs (NRND).

Memory IC Feature Summary

  • Supports standard SPI and Quad I/O interfaces for flexible data transfer.
  • Integrated hardware error correction capabilities for data integrity.
  • Includes security registers with OTP locks for code protection.
  • Features hardware reset functionality and unique ID support.

Memory IC Applications

  • Code storage in embedded systems requiring high reliability.
  • Industrial control applications operating within extended temperature ranges.
  • Consumer electronics utilizing surface-mount assembly techniques.

Memory IC Procurement Notes

Verify the current lifecycle status before integration, as this part is marked NRND. Confirm package compatibility with the TFBGA-24 footprint. Check moisture sensitivity levels for proper handling during assembly. Ensure supply chain stability due to potential discontinuation risks associated with end-of-life components.

Memory IC Selection Notes

Select this component when a 512 Mbit density is required in a compact TFBGA-24 form factor. Consider the 104 MHz speed limit for system timing requirements. Evaluate the industrial temperature range suitability for the target environment. Compare against newer series if long-term availability is critical for the product roadmap.

Memory IC Part Context

This device belongs to the GD25S512MD series of SPI NOR flash memories. It shares core specifications with variants like GD25S512MDYIGR but differs in packaging. The series targets applications needing non-volatile storage with moderate performance and robust feature sets including ECC and security.

Memory IC Replacement Considerations

GD25S512MDYIGR offers identical electrical specifications in an 8-WSON package. GD25S512MDFIGR provides the same performance in a SOP-16 package. Verify pinout compatibility and thermal characteristics when substituting packages.

GD25S512MDBIGYGD25S512MDBIGY

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