Memory IC GD25S512MDFIGR product image

GD25S512MDFIGR

$5.34
  • Description:IC FLASH 512MBIT SPI/QUAD 16SOP
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:1e25e167e3d2 Category: Brand:

  
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GD25S512MDFIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 512MBIT SPI/QUAD 16SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25S512MDFIGR

  • Description:IC FLASH 512MBIT SPI/QUAD 16SOP
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:512Mbit
  • Memory Organization:64M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:104 MHz
  • Write Cycle Time - Word, Page:50µs, 2.4ms
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:16-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package:16-SOP
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25S512MDFIGR

GD25S512MDFIGR

Memory IC Overview

The GD25S512MDFIGR is a non-volatile NOR flash memory integrated circuit manufactured by GigaDevice. It provides a storage capacity of 512 Megabits, organized as 64 Megabytes by 8 bits. The device utilizes a Serial Peripheral Interface with Quad I/O support and operates at a maximum clock frequency of 104 MHz. It functions within a supply voltage range of 2.7V to 3.6V and supports an industrial operating temperature range from -40°C to +85°C. The component is housed in a 16-SOP surface-mount package.

Memory IC Feature Summary

  • Supports SPI and Quad I/O interfaces for high-speed data access
  • Industrial temperature rating ensures reliable operation in harsh environments
  • Uniform sector architecture facilitates efficient data management

Memory IC Applications

  • Code storage for microcontrollers and processors
  • Data logging applications requiring non-volatile retention
  • Firmware storage in embedded systems

Memory IC Procurement Notes

Verify the specific suffix 'GR' against the manufacturer's official datasheet to confirm package dimensions and tape-and-reel specifications. Confirm RoHS compliance status and moisture sensitivity level requirements prior to integration into the manufacturing process. Ensure design-in compatibility with existing system voltage levels.

Memory IC Selection Notes

Select this component when a 512Mb density is required in a 16-pin SOP package. Verify that the system interface supports Quad I/O operations for optimal performance. Consider the NRND status and potential minimum order quantity constraints during the procurement phase.

Memory IC Part Context

This part belongs to the GD25S512MD series of SPI NOR flash memories. It shares core electrical characteristics with other variants in the family but differs in physical packaging. The 16-SOP form factor distinguishes it from smaller footprint options like WSON or TFBGA packages available in the same product line.

Memory IC Replacement Considerations

GD25S512MDYIGR (WSON-8 package)

GD25S512MDFIGRGD25S512MDFIGR
$5.34
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