Memory IC GD25T512MEB2RY product image

GD25T512MEB2RY

$6.50
  • Description:IC FLSH 512MBIT SPI/QUAD 24TFBGA
  • Series:GD25T
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray

SKU:3d1b61e951c8 Category: Brand:

  
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GD25T512MEB2RY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLSH 512MBIT SPI/QUAD 24TFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25T512MEB2RY

  • Description:IC FLSH 512MBIT SPI/QUAD 24TFBGA
  • Series:GD25T
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:512Mbit
  • Memory Organization:64M x 8
  • Memory Interface:SPI - Quad I/O, DTR
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:24-TBGA
  • Supplier Device Package:24-TFBGA (6x8)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25T512MEB2RY

GD25T512MEB2RY

Memory IC Overview

The GD25T512MEB2RY is a 512Mb SPI NOR Flash memory IC manufactured by GigaDevice. It utilizes Single-Level Cell (SLC) technology and supports Quad I/O and Double Data Rate (DTR) interfaces with a clock frequency of up to 200 MHz. The device operates within a voltage range of 2.7V to 3.6V and features a 64M x 8 organization. It is housed in a 24-TFBGA package measuring 6x8 mm, designed for surface mount installation. The component supports an industrial operating temperature range from -40°C to +105°C.

Memory IC Feature Summary

  • Supports high-speed Quad I/O and DTR SPI interfaces for enhanced data throughput
  • Integrates hardware reset functionality and write-protect capabilities
  • Includes security registers with One-Time Programmable (OTP) lock features
  • Provides unique identification capabilities for device tracking

Memory IC Applications

  • Code storage for embedded systems requiring high reliability
  • Industrial control applications demanding wide temperature operation
  • Consumer electronics utilizing surface-mount packaging constraints
  • Automotive-grade electronic systems meeting functional safety standards

Memory IC Procurement Notes

Verify the specific suffix EB2RY against the manufacturer's official datasheet to confirm pinout compatibility and electrical characteristics. Ensure the procurement channel provides original manufacturer documentation. Confirm that the 24-TFBGA package dimensions align with the target PCB footprint. Validate that the supply source guarantees authenticity to prevent counterfeit components in critical infrastructure.

Memory IC Selection Notes

Select this component when a 512Mb density is required alongside high-speed DTR interface support. The 2.7V to 3.6V voltage range suits standard 3.3V logic systems. Consider the 24-TFBGA package size for compact board designs. Verify that the -40°C to +105°C temperature rating meets the environmental requirements of the intended deployment scenario.

Memory IC Part Context

This part belongs to the GD25T series of SPI NOR Flash memories from GigaDevice. The series targets diverse market segments including automotive and industrial applications. It complements other densities in the portfolio ranging from 512Kb to 2Gb. The GD25T series emphasizes high performance and reliability for code execution and data storage needs.

Memory IC Replacement Considerations

Check for GD25T512 variants with different package suffixes if TFBGA availability is limited. Verify cross-compatibility with other 512Mb SPI NOR Flash devices from alternative manufacturers based on pinout and voltage specifications.

GD25T512MEB2RYGD25T512MEB2RY
$6.50
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