GD25T512MEYIGR

Memory IC Overview

The GD25T512MEYIGR is a 512 Mbit NOR flash memory device manufactured by GigaDevice. It utilizes an 8-WSON (6x8 mm) surface-mount package and operates within a supply voltage range of 2.7 V to 3.6 V. The component supports SPI, Quad I/O, and Double Data Rate (DTR) interfaces with a maximum clock frequency of 200 MHz in DTR mode. It functions reliably across an industrial temperature range from -40°C to +85°C.

Memory IC Feature Summary

• Supports high-speed data transfer via Quad I/O and Double Data Rate (DTR) modes
• Provides hardware write protection and absolute write protection capabilities
• Includes security registers with One-Time Programmable (OTP) lock features
• Features built-in Error Correction Code (ECC) for enhanced data reliability

Memory IC Applications

• Code storage for embedded systems requiring high performance
• Industrial control applications operating in wide temperature ranges
• Consumer electronics devices utilizing surface-mount technology
• Automotive infotainment and connectivity modules

Memory IC Procurement Notes

Verify the specific suffix YIGR corresponds to the 8-WSON 6x8mm package and reel packaging configuration. Confirm that the required clock speed and interface modes align with system design constraints. Ensure compatibility with the specified 2.7V to 3.6V power supply rails. Check for any automotive qualification requirements if used in vehicle systems.

Memory IC Selection Notes

Select this component when a compact 8-pin footprint is required alongside high-speed DTR interface support. It is suitable for designs needing robust security features like OTP locks and hardware write protection. Consider this part for applications demanding reliable code execution from non-volatile memory in industrial or consumer environments.

Memory IC Part Context

This device belongs to the GD25T series of SPI NOR flash memories from GigaDevice. The series targets diverse market segments including consumer electronics and automotive systems. It offers scalability in density and supports various packages to meet different application requirements for performance and size.

Memory IC Replacement Considerations

GD25B512MEYIGR: Supports similar capacity but may differ in interface speeds and specific feature sets. Verify pinout and electrical characteristics before substitution.