GD25UF128EQIGR

$1.23

Description：IC FLASH
Series：-
Mfr：GigaDevice Semiconductor (HK) Limited
Package：Tape & Reel (TR)

SKU:5076a62c3038 Category: Memory IC Brand: GigaDevice Semiconductor (HK) Limited

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Product introduction

GD25UF128EQIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25UF128EQIGR

Description：IC FLASH
Series：-
Mfr：GigaDevice Semiconductor (HK) Limited
Package：Tape & Reel (TR)
Memory Type：-
Memory Format：FLASH
Technology：FLASH - NOR
Memory Size：-
Memory Organization：-
Memory Interface：-
Clock Frequency：-
Write Cycle Time - Word, Page：-
Voltage - Supply：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Access Time：-
Grade：-
Qualification：-

Memory IC datasheet and documents for GD25UF128EQIGR

GD25UF128EQIGR

Memory IC Overview

The GD25UF128EQIGR is a 128 Mbit NOR flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 1.14 V to 1.26 V, supporting ultra-low power applications. The component utilizes DTR, Dual, Quad SPI, and standard SPI interface types with a maximum clock frequency of 120 MHz. It features synchronous timing and an 8-bit data bus width. Designed for surface mount installation, the device functions reliably across a temperature range of -40°C to +85°C.

Memory IC Feature Summary

Supports Double Transfer Rate (DTR) mode for high-speed data transfer
Ultra-low power architecture optimized for advanced process node SoCs
Dual-voltage design capability for flexible system integration

Memory IC Applications

System on Chip (SoC) designs requiring low voltage operation
Power-sensitive embedded systems
Mobile communication devices

Memory IC Procurement Notes

Verify specific ordering suffixes against official datasheets to ensure correct package and tape-and-reel specifications. Confirm RoHS compliance status directly with the manufacturer or authorized distributors prior to procurement. Check current availability as supply constraints may affect lead times. Ensure compatibility with existing board layouts regarding the USON-8 package dimensions.

Memory IC Selection Notes

Select this component when designing systems that require a 1.2V core voltage interface without external level shifters. Compare performance metrics such as access time and power consumption against standard 1.8V or 3.3V alternatives. Consider the USON-8 package size for space-constrained PCB layouts. Validate thermal performance within the specified operating temperature range.

Memory IC Part Context

This part belongs to the GD25UF series, which represents GigaDevice's ultra-low power NOR flash line. These devices are engineered specifically for modern System on Chips built on advanced process nodes. The series emphasizes reduced power consumption while maintaining reliable data storage capabilities for code execution.