GD25WD05EK6IGR

Memory IC Overview

The GD25WD05EK6IGR is a NOR flash memory device manufactured by GigaDevice, housed in a USON-6 surface-mount package. It provides a storage capacity of 512 kbit organized as 64k x 8 bits with an 8-bit data bus width. The component operates on a synchronous timing type and supports Dual SPI and SPI interface types. It functions within a power supply voltage range of 1.65 V to 3.6 V, with a maximum active read current of 6 mA. The maximum clock frequency is 104 MHz. The device is rated for an operating temperature range from -40 C to +85 C.

Memory IC Feature Summary

• Supports Dual SPI and standard SPI interface protocols for flexible system integration.
• Operates within a wide voltage range of 1.65 V to 3.6 V suitable for various logic levels.
• Designed for surface mount installation in compact USON-6 packages.

Memory IC Applications

• Embedded systems requiring small code storage
• Consumer electronics firmware storage
• IoT device configuration memory

Memory IC Procurement Notes

Verify the specific suffix codes against official datasheets to ensure correct package and temperature ratings. Confirm RoHS compliance status through manufacturer documentation before integration. Check for any regional sales restrictions or distribution limitations that may affect availability. Ensure compatibility with existing PCB footprints for the USON-6 package type.

Memory IC Selection Notes

Select this component when a small form factor is required alongside moderate density storage needs. The USON-6 package offers space efficiency compared to larger SOP options. Verify that the 104 MHz clock speed meets system performance requirements. Ensure the operating voltage aligns with the target application's power supply rails.

Memory IC Part Context

This part belongs to the GD25WD series of SPI NOR Flash memories from GigaDevice. The series targets applications needing reliable non-volatile storage in compact designs. It complements other densities in the portfolio, offering a balance between capacity and physical size for embedded solutions.

Memory IC Replacement Considerations

Check for pin-compatible alternatives within the same GD25WD family. Verify if higher density variants like GD25WD10 or lower density options fit the design constraints. Ensure interface compatibility remains consistent when substituting.