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GD25WD05ETIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 512KBIT SPI/DUAL 8SOP. Review the specifications below when checking this part for your BOM.
The GD25WD05ETIGR is a NOR flash memory component manufactured by GigaDevice. It features a storage capacity of 512 kbit organized as 64 k x 8 bits with an 8-bit data bus width. The device supports Dual SPI and standard SPI interfaces, operating at a maximum clock frequency of 104 MHz. It functions within a supply voltage range of 1.65 V to 3.6 V, with a maximum active read current of 6 mA. The part is housed in an SOP-8 package for surface mount installation and operates reliably across a temperature range of -40°C to +85°C.
Verify the specific suffix 'IGR' against official manufacturer documentation to confirm package type and tape-and-reel specifications. Confirm RoHS compliance status through certified datasheets prior to implementation. Ensure the selected variant matches the required SOP-8 footprint and lead pitch for PCB layout compatibility. Validate that the 104 MHz clock speed meets the target system's timing requirements.
Select this component when a 512 kbit density is sufficient for application needs. Consider the SOP-8 package if space constraints allow for larger footprints compared to USON options. Verify that the 1.65 V minimum voltage aligns with the system power rail. Evaluate the 104 MHz interface speed against processor capabilities to ensure optimal data throughput without bottlenecking.
This part belongs to the GD25WD series of SPI NOR flash memories from GigaDevice. The series targets applications demanding high performance and low power consumption. It complements other densities in the portfolio, such as the GD25WD10CTIGR (1 Mbit) and GD25WD20CTIGR (2 Mbit), offering scalable storage options within the same operational envelope and interface standards.
GD25LD05ETIGR offers similar capacity but operates at a lower 50 MHz clock frequency.
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