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GD25WD10CEIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLSH 1MBIT SPI/QUAD I/O 8USON. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25WD10CEIGR
- Description：IC FLSH 1MBIT SPI/QUAD I/O 8USON
- Series：-
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR),Cut Tape (CT)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR
- Memory Size：1Mbit
- Memory Organization：128K x 8
- Memory Interface：SPI - Quad I/O
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：1.65V ~ 3.6V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-XFDFN Exposed Pad
- Supplier Device Package：8-USON (2x3)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25WD10CEIGR
Memory IC Overview
The GD25WD10CEIGR is a 1 Mbit SPI NOR Flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 1.65 V to 3.6 V, supporting flexible power integration. The component utilizes an 8-pin USON package with dimensions of 3x2x0.45 mm. It supports industrial temperature ranges from -40°C to +85°C and is supplied in tape and reel packaging.
Memory IC Feature Summary
- Supports wide voltage operation for diverse system power requirements
- Compact surface-mount package design for space-constrained applications
- Industrial-grade thermal stability for harsh environments
Memory IC Applications
- Industrial control systems
- Consumer electronics firmware storage
- IoT device code retention
Memory IC Procurement Notes
Verify the specific suffix 'GR' indicates tape and reel packaging configuration. Confirm the 'W' designation aligns with the required 1.65V-3.6V voltage range specifications. Ensure the USON-8 footprint matches the PCB layout constraints. Validate RoHS compliance status against current regulatory requirements before finalizing procurement orders.
Memory IC Selection Notes
Select this component when a 1 Mbit capacity is sufficient for application needs. Choose this part for designs requiring low-voltage compatibility starting at 1.65 V. Consider the USON-8 package for minimal board area consumption. Verify that the industrial temperature range meets the operational environment standards.
Memory IC Part Context
This part belongs to the GD25WD series of SPI NOR Flash memories. The series targets applications requiring small form factors and wide voltage support. It complements other densities in the GigaDevice portfolio designed for embedded code storage solutions.
Memory IC Replacement Considerations
Check for pin-compatible alternatives within the same series offering different capacities or voltage ranges. Verify package dimensions and electrical characteristics match exactly before substitution.
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