GD25WD10EK6IGR

Memory IC Overview

The GD25WD10EK6IGR is a 1 Mbit NOR flash memory device manufactured by GigaDevice. It features a USON-6 surface-mount package and supports Dual SPI and standard SPI interfaces. The component operates within a supply voltage range of 1.65 V to 3.6 V, with a maximum active read current of 6 mA. It achieves a maximum clock frequency of 104 MHz and utilizes a synchronous timing type. The memory organization is specified as 128 k x 8 with an 8-bit data bus width. The device is rated for industrial operating temperatures between -40°C and +85°C.

Memory IC Feature Summary

• Supports Dual SPI and standard SPI interface protocols for flexible system integration.
• Operates on a wide supply voltage range from 1.65 V to 3.6 V.
• Provides high-speed data access with a maximum clock frequency of 104 MHz.
• Utilizes a compact USON-6 surface-mount package design.

Memory IC Applications

• Consumer electronics requiring small form factor storage
• Industrial control systems needing reliable code execution
• Embedded applications utilizing SPI-based microcontrollers

Memory IC Procurement Notes

Verify the specific suffix 'K6' against the manufacturer's official datasheet to confirm pinout and electrical characteristics match your design requirements. Ensure the USON-6 package dimensions align with your PCB footprint constraints. Confirm RoHS compliance status through the latest documentation before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 1 Mbit capacity is sufficient for firmware storage in space-constrained designs. The low voltage operation down to 1.65 V makes it suitable for battery-powered devices. Verify that the host controller supports the required Dual SPI or standard SPI modes to utilize the specified performance levels effectively.

Memory IC Part Context

This part belongs to the GD25WD series of SPI NOR flash memories from GigaDevice. The series targets applications demanding high performance and low power consumption. These devices are designed to provide scalable storage solutions for various embedded systems, balancing density with physical size constraints.

Memory IC Replacement Considerations

Consult the official GigaDevice product selection guide for direct replacements. Verify compatibility regarding package type, voltage range, and interface speed before substituting.