Memory IC GD25WD80EKEGR product image

GD25WD80EKEGR

$0.46
  • Description:IC FLASH 8MBIT SPI/DUAL 8USON
  • Series:GD25WD
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:32cdb8902f2d Category: Brand:

  
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GD25WD80EKEGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 8MBIT SPI/DUAL 8USON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25WD80EKEGR

  • Description:IC FLASH 8MBIT SPI/DUAL 8USON
  • Series:GD25WD
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:8Mbit
  • Memory Organization:1M x 8
  • Memory Interface:SPI - Dual I/O
  • Clock Frequency:104 MHz
  • Write Cycle Time - Word, Page:120µs, 6ms
  • Voltage - Supply:1.65V ~ 3.6V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-XFDFN Exposed Pad
  • Supplier Device Package:8-USON (1.5x1.5)
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25WD80EKEGR

GD25WD80EKEGR

Memory IC Overview

The GD25WD80EKEGR is an 8Mbit (1M x 8) SPI NOR Flash memory component manufactured by GigaDevice. It supports Dual I/O interface with a maximum clock frequency of 104 MHz and access time of 6 ns. The device operates within a voltage range of 1.65V to 3.6V and features a write cycle time of 100µs for word and 6ms for page. It is housed in an 8-USON (1.5x1.5) package with exposed pad, suitable for surface mount installation. The operating temperature range extends from -40°C to +85°C.

Memory IC Feature Summary

  • Supports high-speed Dual I/O SPI interface for efficient data transfer
  • Non-volatile SLC NAND technology ensures reliable data retention
  • Compact 8-USON package design optimized for space-constrained applications

Memory IC Applications

  • Embedded systems requiring non-volatile code storage
  • Consumer electronics with limited board space
  • Industrial control devices needing wide temperature operation

Memory IC Procurement Notes

Verify the exact suffix 'KEGR' against official Gigadevice documentation, as standard listings often use 'IGR'. Confirm package type matches 8-USON specifications. Check RoHS3 compliance status directly with the manufacturer. Ensure availability aligns with current supply chain conditions. Validate pinout compatibility if replacing existing components.

Memory IC Selection Notes

Select this part when Dual I/O speed is required over Quad or standard SPI. Compare against GD25WD80ESIGR for similar performance in different packages. Consider thermal requirements given the -40°C to 85°C range. Evaluate power consumption at 1.65V minimum voltage. Verify that the 8USON footprint fits the PCB layout constraints.

Memory IC Part Context

Part of the GD25WD series focusing on Dual I/O capabilities. Distinct from GD25QD (Quad) and GD25LD (Low Power) variants. Shares core architecture with GD25WD80ETIGY but differs in packaging. Designed for cost-sensitive applications requiring moderate speed.

Memory IC Replacement Considerations

GD25WD80ESIGR offers similar electrical characteristics in a different package. GD25WD80ETIGY provides equivalent functionality in SOP-8 format. Verify pin-to-pin compatibility before substitution.

GD25WD80EKEGRGD25WD80EKEGR
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