Memory IC GD25WQ20EEIGR product image

GD25WQ20EEIGR

$0.34
  • Description:IC FLASH 2MBIT SPI/QUAD 8USON
  • Series:GD25WQ
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:571eefb8cc4b Category: Brand:

  
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GD25WQ20EEIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 2MBIT SPI/QUAD 8USON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25WQ20EEIGR

  • Description:IC FLASH 2MBIT SPI/QUAD 8USON
  • Series:GD25WQ
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:2Mbit
  • Memory Organization:256K x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:104 MHz
  • Write Cycle Time - Word, Page:120µs, 4ms
  • Voltage - Supply:1.65V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-XFDFN Exposed Pad
  • Supplier Device Package:8-USON (3x2)
  • Access Time:7 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25WQ20EEIGR

GD25WQ20EEIGR

Memory IC Overview

The GD25WQ20EEIGR is a 2M-bit (256K x 8) SPI NOR flash memory manufactured by GigaDevice. It supports standard, dual, and quad SPI interfaces with a maximum clock frequency of 104 MHz. The device operates on a single power supply ranging from 1.65 V to 3.6 V. It features uniform sector architecture with 4 KB sectors and 32/64 KB blocks. Key electrical characteristics include a typical standby current of 11 μA and deep power-down current of 0.1 μA. The memory organization allows for page programming of up to 256 bytes.

Memory IC Feature Summary

  • Supports Dual and Quad SPI modes for high-speed data transfer up to 416 Mbits/s.
  • Provides flexible software and hardware write protection mechanisms via status register bits and the WP# pin.
  • Includes advanced security features such as a 128-bit unique ID and programmable security registers with OTP locks.

Memory IC Applications

  • Execute In Place (XiP) operation for code storage in embedded systems.
  • Data logging and firmware storage in consumer electronics.
  • Parameter storage in industrial control devices requiring reliable non-volatile memory.

Memory IC Procurement Notes

Verify the specific ordering suffix 'EIGR' against the manufacturer's official datasheet to confirm package type and tape/reel specifications. Ensure compatibility with the required voltage range and interface mode before integration. Cross-reference the component marking with the device ID commands to authenticate the source. Confirm that the requested quantity aligns with the manufacturer's minimum order requirements for the selected packaging format.

Memory IC Selection Notes

Select this component when a 2 Mbit capacity is sufficient for application requirements. The 1.65 V to 3.6 V operating range makes it suitable for low-voltage designs. Consider the USON-8 package if space constraints are critical. Verify that the host controller supports the necessary SPI modes, including Quad I/O if maximum read speeds are required. Check the endurance rating of 100,000 cycles against the expected write frequency of the target system.

Memory IC Part Context

This part belongs to the GD25WQ series of uniform sector serial flash memories. It shares architectural similarities with the GD25WQ40E but offers half the density. The series is designed for applications requiring fast program/erase speeds and robust data retention. It complements other GigaDevice NOR flash products by providing a compact solution for smaller code or data storage needs.

Memory IC Replacement Considerations

GD25WQ20ETIGR

GD25WQ20EEIGRGD25WQ20EEIGR
$0.34
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